Heat Spreader and Barrier for Semiconductor Die Thermal Management
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Solution Overview
Problem
The increasing heat generation in small, high-speed semiconductor devices with multiple die stacks poses challenges for thermal management due to poor thermal conductivity of packaging materials and the formation of voids and hot spots, which can lead to elevated die temperatures and reduced heat dissipation.
Innovation Solution
The implementation of heat spreaders and barriers with high thermal conductivity, formed from materials like copper, to create enhanced thermal paths and prevent the wicking and pooling of underfill materials, thereby improving heat dissipation and reducing void formation between die stacks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If smaller device sizes are used to increase functionality and speed, then device integration and operational performance are improved, but internal heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a heat spreader layer positioned between the semiconductor die and the package substrate, creating an additional thermal management dimension. This intermediate layer spreads heat laterally across a larger area before dissipation, transforming the vertical heat flow path into a combined lateral and vertical distribution system, thereby reducing peak temperatures while maintaining compact device dimensions.
Solution Approach 2:
The heat spreader acts as an intermediary thermal management component between the heat-generating die and the package substrate. This intermediate structure facilitates heat redistribution and provides a controlled thermal pathway, mediating the heat transfer process to prevent localized overheating while supporting the high-functionality, small-form-factor design requirements.
2Productivity
If multiple die are stacked within a single package to increase functionality, then device capability is improved, but heat dissipation paths become more complex and thermal management becomes more difficult
Solution Approach 1:
The patent segments the thermal management function into distinct layers: individual heat spreader layers are positioned between each die and the package substrate, creating separate thermal management zones for each die stack. This segmentation allows independent thermal control and simplifies the heat dissipation path for each die group, making thermal management of multi-die packages more manageable.
Solution Approach 2:
By introducing heat spreader layers that extend laterally between die stacks, the patent adds a lateral heat distribution dimension to the primarily vertical heat flow paths. This dimensional addition provides alternative thermal pathways that bypass the complexity of direct vertical heat transfer through multiple die interfaces, simplifying overall thermal management.
3Strength
If underfill material is used to fill spaces between die stacks, then structural support is improved, but void formation and hot spots increase due to material wicking and pooling
Solution Approach 1:
The heat spreader layer is positioned and configured before underfill material is applied. This preliminary placement creates a physical barrier that prevents underfill wicking and pooling before the problem can occur, maintaining proper material distribution and preventing void formation and hot spot generation while still allowing the underfill to provide structural support.
Solution Approach 2:
The heat spreader serves as an intermediary barrier between the die stacks and the underfill material. This intermediate structure controls the interaction between the underfill and die interfaces, preventing harmful wicking and pooling behaviors while allowing the underfill to fulfill its structural support function without generating voids or hot spots.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance by providing efficient heat transfer paths and reducing the formation of hot spots, ensuring that semiconductor die stacks operate within safe temperature limits and maintain performance.
Implementation Method 1
heat spreaders and barriers with high thermal conductivity, formed from materials like copper, to create enhanced thermal paths
Implementation Method 2
prevent the wicking and pooling of underfill materials
Data Source
AI summary
Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.