Heat Spreader Cavities for Passive Component Nesting
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Solution Overview
Problem
The thickness of integrated circuit (IC) packages is limited by mechanical interference between components, particularly capacitors or passive devices mounted on the substrate, which exceeds the thickness of the IC chip, hindering the miniaturization of mobile computing devices.
Innovation Solution
A heat spreader with cavities or openings is thermally coupled to the IC chip, allowing passive components on the substrate to be partially disposed within these cavities, thereby reducing the overall package thickness by eliminating interference with the heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If capacitors or passive devices are mounted on the substrate, then the IC package can include necessary electronic components, but the package thickness increases beyond the IC chip thickness
Solution Approach 1:
The patent applies nesting by placing capacitors and passive devices inside cavities formed in the heat spreader. The heat spreader acts as a container structure that houses these components within its thickness, allowing them to be nested within the overall package volume rather than adding to the external dimensions. This enables the package to contain necessary components while maintaining a thin profile.
Solution Approach 2:
The patent transitions from a two-dimensional mounting approach (components on the substrate surface) to a three-dimensional arrangement by forming cavities within the heat spreader. This allows components to be positioned in the vertical dimension within the heat spreader thickness, effectively utilizing the Z-axis space rather than increasing the overall package thickness.
2Length of stationary object
If the package thickness is reduced to minimize mobile device size, then mobile devices can be thinner and lighter, but mechanical interference occurs between passive devices and the heat spreader
Solution Approach 1:
By nesting capacitors and passive devices within cavities in the heat spreader, the patent eliminates mechanical interference between these components and the heat spreader exterior. The cavities provide dedicated space that prevents contact and interference, allowing the heat spreader to maintain its thin profile without compromising component placement.
Solution Approach 2:
The cavities in the heat spreader act as intermediary spaces that mediate between the passive devices and the heat spreader structure. These cavities provide isolation and prevent direct mechanical contact, eliminating interference while still allowing the components to be housed within the overall package structure.
3Adaptability or versatility
If passive devices are mounted on the substrate, then necessary electronic functions are achieved, but the device height exceeds the IC chip thickness
Solution Approach 1:
The patent nests capacitors and passive devices within the heat spreader cavities, allowing the package to maintain full electronic functionality while keeping the overall device height equal to or greater than only the IC chip thickness. The necessary electronic components are housed within the heat spreader volume rather than extending beyond it.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the minimum thickness of the IC system to be limited by the IC chip and heat spreader alone, enabling thinner and lighter mobile devices without increasing the package thickness.
Implementation Method 1
a heat spreader that is thermally coupled to a semiconductor chip
Data Source
AI summary
An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.