Heat Spreader Dissipation in Dual-Chassis Computing Devices

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Solution Overview

Problem

Converged mobility devices face challenges in thermal dissipation due to the high heat generated by powerful computing components, which limits their operating speed and efficiency, especially in compact form factors like dual-chassis devices.

Innovation Solution

A heat spreader made of thermally conductive materials like graphite, sandwiched within a protective layer, is used to dissipate heat from the primary chassis to a secondary chassis, which acts as a heat sink, allowing for increased thermal budget and flexibility in device configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If powerful computing components are used in dual-chassis devices, then processing power and performance are improved, but heat generation increases and thermal dissipation becomes difficult

Engineering Contradiction:

Improveprocessing powerVSAvoidoperating temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The device is divided into two separate chassis: a first chassis containing heat-generating components (processor, graphics processing unit) and a second chassis with lower heat generation. This segmentation allows heat to be isolated in one section while the other serves as a thermal sink, resolving the contradiction between high processing power and thermal management.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat spreader is introduced as an intermediary component between the first and second chassis. This heat spreader conducts heat from the high-power components in the first chassis to the second chassis, enabling thermal dissipation while maintaining the high processing power capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If heat spreader is made flexible to accommodate device folding, then adaptability is improved, but thermal conduction efficiency may be reduced

Engineering Contradiction:

Improvedevice flexibilityVSAvoidheat transfer efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The heat spreader is constructed as a flexible sheet comprising multiple layers including a flexible polymer base layer and thermally conductive particles or flakes dispersed within. This flexible film structure accommodates device folding and bending while maintaining adequate thermal conduction through the distributed conductive particles.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The heat spreader uses a composite material structure combining a flexible polymer matrix with thermally conductive particles (such as aluminum oxide, boron nitride, or metal flakes). This composite approach provides both the required flexibility for device folding and sufficient thermal conduction capability to bridge the temperature difference between chassis.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables converged mobility devices to operate at higher power levels with reduced operating temperatures, enhancing performance and ergonomics while withstanding multiple bend cycles, thus maintaining device functionality.

Implementation Method 1

a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second chassis hingeably coupled to the first chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis

Methodology Applied

Scientific EffectHeat sink: Heat Sink

Data Source

PatentUS11755080B2Thermal dissipation in dual-chassis devices

Publication Date: 2023.09.12 INTEL CORP

AI summary

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.