Heat Spreader Edge Standoffs for Microelectronic Bond Line Control

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Solution Overview

Problem

The challenge in microelectronic packages is managing heat dissipation for multiple devices, where the heat dissipation device may bottom out, leading to unpredictable bond lines, thermal performance issues, and potential damage due to variability in the direct device attach process and sealant delamination.

Innovation Solution

Incorporating standoffs between the heat dissipation device projections and the microelectronic substrate to control bond line thickness, ensuring consistent thermal interface material distribution and preventing the heat dissipation device from tilting or contacting individual microelectronic devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat dissipation device is directly attached to multiple microelectronic devices, then heat removal efficiency is maximized, but the bond line thickness becomes unpredictable and the device may tilt causing sealant delamination

Engineering Contradiction:

Improveheat removal efficiencyVSAvoidbond line thickness consistency

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent introduces a thermal interface material as an intermediary substance between the heat dissipation device and the microelectronic devices. This intermediary layer fills the gaps and varies in thickness to accommodate height differences between multiple devices, ensuring consistent thermal contact while preventing direct mechanical contact that would cause tilting and sealant delamination.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the heat dissipation device contacts individual microelectronic devices, then thermal contact is achieved, but device deformation and cracking may occur

Engineering Contradiction:

Improvethermal contact qualityVSAvoiddevice deformation and cracking

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies a compliant thermal interface material that acts as a cushioning layer before direct contact between the rigid heat dissipation device and the microelectronic devices. This cushioning effect distributes the mechanical load evenly across all devices, preventing localized stress concentrations that would cause deformation and cracking while maintaining effective thermal contact.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Area of stationary object

If multiple microelectronic devices are managed by a single heat dissipation device, then thermal management coverage is improved, but unpredictable bottoming out and bond line variability occur

Engineering Contradiction:

Improvethermal management coverageVSAvoidbond line predictability

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent changes the physical parameters of the thermal interface material to accommodate height variations among multiple devices. By selecting materials with appropriate compliance, viscosity, and fill properties, the system can adapt to different device heights and maintain consistent bond line thickness across the entire thermal management area, eliminating unpredictable bottoming out.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains consistent bond line thickness, enhances the reliability of the microelectronic package by preventing deformation and sealant degradation, thereby improving thermal performance and reducing the risk of device damage.

Implementation Method 1

a thermal interface material is generally disposed between the microelectronic device(s) and the heat dissipation device to form thermal contact therebetween

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11652018B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

Publication Date: 2023.05.16 INTEL CORP

AI summary

A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.