Heat Spreader Integration for Non-Uniform Airflow Cooling
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Solution Overview
Problem
Rack-mounted computing devices face thermal management challenges due to non-uniform airflow, which limits heat dissipation in areas with low airflow, necessitating costly solutions like liquid cooling or thermoelectric coolers.
Innovation Solution
Integration of a heat spreader, such as a vapor chamber, into the outer chassis of computing devices to transfer heat from low airflow areas to locations with higher airflow, using heat bridges and strategically placed heat dissipating structures like finned heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans force airflow through the computing device to cool heat generating modules, then cooling is provided, but airflow is non-uniform leading to areas of low or no airflow where heat dissipation is limited
Solution Approach 1:
A heat spreader is introduced as an intermediary component between heat generating modules in low airflow areas and the airflow path. The heat spreader conducts heat from modules in low airflow zones to locations with higher airflow, enabling effective cooling without requiring uniform airflow distribution throughout the device.
Solution Approach 2:
The heat spreader extends the heat transfer path into additional spatial dimensions by conducting heat laterally across the device structure to areas with higher airflow velocity, rather than relying solely on vertical airflow through the modules themselves.
2Temperature
If liquid cooling or thermoelectric coolers are used to transfer heat from low airflow areas, then heat dissipation is improved, but additional expenses and infrastructure investment are required
Solution Approach 1:
The invention uses a simple, cost-effective heat spreader made of thermally conductive material that can be integrated into the existing device structure. This passive heat transfer component eliminates the need for expensive liquid cooling systems or thermoelectric coolers, providing a budget-friendly solution for improving heat dissipation in low airflow areas.
Solution Approach 2:
The heat spreader is a passive component that utilizes natural heat conduction and the existing airflow in the device to transfer heat without requiring active pumping, compression, or electrical power input. The system serves itself by using the device's own structural elements and airflow to achieve heat redistribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling capacity by effectively dissipating heat from areas with low airflow without the need for exotic cooling methods, providing cost savings and a space-conscious design.
Implementation Method 1
The heat spreader is integrated into the outer chassis. The at least one heat bridge couples the heat spreader to at least one corresponding heat generating module at a first location in the computing device. The first heat dissipating structure is coupled to the heat spreader at a second location in the computing device.
Implementation Method 2
The second location is positioned in the computing device to experience higher airflow than the first location.
Data Source
AI summary
A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.