Heat Spreader Assembly Lateral Locking Bars Semiconductor
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Solution Overview
Problem
Conventional heat spreader configurations are not suitable for tight substrate layouts in semiconductor devices, as they require significant space and may not provide strong enough attachment between the semiconductor die and the substrate, especially when mounting larger dies and smaller discrete components.
Innovation Solution
A heat spreader assembly with a pair of locking bars and protrusion ribs that securely attach to the substrate, allowing for efficient heat dissipation and preventing the heat spreader from moving away from the substrate, while accommodating tight layout requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional heat spreader with foot portion and slope sidewall portion is used, then the heat spreader can be attached to the substrate, but the mounting space required on the substrate limits the ability to mount more components in tight layouts
Solution Approach 1:
The heat spreader is designed to be mounted on the lateral surface of the substrate rather than the top surface, utilizing the vertical dimension and side surface area. This dimensional transition allows the heat spreader to be positioned without occupying top surface mounting space, enabling tighter component layouts while maintaining effective heat dissipation attachment.
2Device complexity
If the heat spreader is directly secured onto the semiconductor die without foot portion, then the attachment structure is simplified, but stronger attachment is needed to withstand the total weight of the die and heat spreader
Solution Approach 1:
The attachment structure is segmented into multiple discrete attachment elements distributed around the perimeter of the semiconductor die. This segmentation allows the attachment function to be distributed across multiple points, reducing the complexity of any single attachment point while collectively providing sufficient strength to support the combined weight of the die and heat spreader.
3Area of stationary object
If the heat spreader is secured at lateral surfaces of the substrate, then the top surface mounting space is preserved, but an extra structure is needed for engaging the heat spreader with the lateral surfaces
Solution Approach 1:
Instead of extending attachment structures from the top surface to engage the lateral surface, the engagement structure is inverted to extend from the lateral surface upward to meet the heat spreader. This inversion simplifies the engagement mechanism by allowing the lateral surface structure to directly interface with the heat spreader's mounting features without requiring complex top-surface extensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader assembly enables effective heat dissipation and secure attachment to the substrate, even in tight layouts, ensuring the semiconductor die operates within a rated temperature range without increasing the complexity of the device structure.
Implementation Method 1
a heat spreader to transfer from the die to a surrounding environment
Implementation Method 2
a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively, wherein the pair of protrusion ribs is configured to, when the heat spreader body is pushed towards the substrate, slide past the locking hooks of the pair of locking bars and be engaged within the slots to prevent the heat spreader from moving away from the substrate
Data Source
AI summary
Provided is a heat spreader assembly comprising: a pair of locking bars mounted on a substrate of a semiconductor device and at two opposite sides of at least one semiconductor die, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot; and a heat spreader comprising: a heat spreader body comprising a top portion and a pair of lateral portions, the heat spreader body defining a space for receiving the at least one semiconductor die; and a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively, wherein the pair of protrusion ribs is configured to slide past the locking hooks of the pair of locking bars and be engaged within the slots to prevent the heat spreader from moving away from the substrate of the semiconductor device.