Heat Spreader Layer Embedded Component Carrier Thermal Management
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Solution Overview
Problem
Existing electronic devices, particularly mobile devices like smartphones and tablets, face challenges in efficiently dissipating heat generated by high heat-producing components due to insulating effects of PCB laminate layers and reliance on quality and arrangement of heat conductive fillers.
Innovation Solution
A heat spreader layer is positioned externally as part of the device's casing, thermoconductively coupled with embedded heat-releasing components, using highly conductive materials like metals or ceramics to enhance heat dissipation, and can be integrated with the component carrier to form a robust and lightweight casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If PCB laminate layers are used to embed heat-releasing components, then component integration and miniaturization are improved, but heat dissipation deteriorates due to insulating effects
Solution Approach 1:
The patent extracts the heat dissipation function from the insulating PCB laminate layers by introducing a separate heat spreader layer made of thermally conductive material. This heat spreader is positioned between the heat-releasing component and the device housing, effectively separating the embedding function (PCB) from the heat dissipation function (heat spreader), thereby resolving the contradiction between miniaturization and heat dissipation.
Solution Approach 2:
The patent introduces a heat spreader layer as an intermediary component between the heat-releasing component and the housing. This intermediary layer made of thermally conductive material (such as aluminum or copper) facilitates heat transfer from the component to the housing, overcoming the insulating barrier presented by the PCB laminate layers and enabling effective heat dissipation in miniaturized devices.
2Temperature
If heat conductive fillers are used to improve heat dissipation, then thermal management is enhanced, but reliability depends on quality and arrangement of fillers
Solution Approach 1:
The patent changes the material parameter of the heat spreader from conventional heat conductive fillers to a solid heat spreader layer made of thermally conductive materials (aluminum, copper, or their alloys). This parameter change from filler-based to solid-layer construction provides more consistent and predictable thermal conductivity, improving reliability by eliminating variability associated with filler quality and arrangement.
Solution Approach 2:
The patent employs composite material construction where the heat spreader layer is integrated with the PCB assembly. The heat spreader can be made of aluminum or copper materials, forming a composite structure that combines the electrical embedding capabilities of PCB with the thermal management capabilities of metal heat spreaders, achieving reliable and consistent heat dissipation.
3Temperature
If heat spreader layer is integrated as part of casing, then thermal management and structural robustness are improved, but device complexity increases
Solution Approach 1:
The patent merges the heat spreader layer with the device housing structure, creating an integrated component that serves dual functions: thermal management and structural support. By combining these functions into a single integrated element rather than separate components, the patent actually reduces overall device complexity while achieving both heat dissipation and structural robustness.
Solution Approach 2:
The heat spreader layer integrated into the housing serves multiple functions simultaneously: it acts as a thermal conduction path for heat dissipation, provides structural support for the device housing, and serves as a mounting surface for heat-releasing components. This multi-functionality reduces the need for separate components, thereby simplifying the overall device structure despite the enhanced thermal management capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves thermal management by efficiently dissipating heat into the surroundings, enhancing the stability and robustness of the device while maintaining a compact design, and can be manufactured using Embedded Components Packaging (ECP) technology.
Implementation Method 1
the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer
Data Source
Figure 1A~1E
Figure 2A~3B
Figure 4A~5
AI summary
The invention relates to a component carrier (1, 10) for an electronic device (20), the component carrier (1, 10) comprising at least one heat-releasing component (22) that is embedded within at least one carrier layer (12, 15, 16) of the component carrier (1, 10), and wherein the at least one embedded heat-releasing component (22) is thermoconductively coupled (100) to a heat spreader layer (30), characterized in that the heat spreader layer (30) forms at least an outside section (41) of a casing (40) of said electronic device (20). Also an electronic device (20) that comprises at least one component carrier (1, 10) according to the invention, as well as a method to produce a respective component carrier (1, 10) are indicated.