Integrated Heat Spreader With Multi-Depth Cavities for Mixed Chip Heights
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Solution Overview
Problem
Existing heat spreaders in computer chip packages face challenges in optimizing cavity depths and shapes to accommodate chips and processors of varying thicknesses, limiting their ability to efficiently dissipate heat and accommodate multiple components simultaneously.
Innovation Solution
A heat spreader design featuring two cavities of different depths, with a stamping process using multiple dies and punches to form the desired shape and periphery, allowing for the accommodation of chips and processors of different thicknesses and enabling simultaneous placement of multiple components, while maintaining constant cavity depths through precise material transfer and shaping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single cavity depth is used in the heat spreader, then the manufacturing process is simple, but it cannot accommodate chips of varying thicknesses
Solution Approach 1:
The heat spreader features multiple cavities with different depths (first cavity with depth D1, second cavity with depth D2) to accommodate chips of varying thicknesses. Each cavity is locally optimized for specific chip thickness requirements, allowing the same heat spreader to handle different chip types without requiring customization of the entire component.
2Manufacturing precision
If multiple stamping processes are used to form different cavity depths, then precise cavity depth control is achieved, but the manufacturing complexity increases
Solution Approach 1:
The stamping process is divided into multiple sequential steps, with each step forming a specific cavity depth. The first stamping process forms the first cavity to depth D1, and the second stamping process forms the second cavity to depth D2. This segmentation allows precise control of each cavity depth independently while maintaining overall manufacturing feasibility through standardized stamping operations.
3Area of stationary object
If the heat spreader accommodates multiple components simultaneously, then thermal management coverage is improved, but the structural design becomes more complex
Solution Approach 1:
The heat spreader is designed with multiple cavities of different depths to simultaneously accommodate multiple chips or processors of varying thicknesses on a single heat spreader body. This multi-functional design allows one heat spreader to serve multiple thermal management functions, improving heat dissipation coverage across different component configurations without requiring separate heat spreaders for each chip type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader effectively disperses heat across its surface, accommodating various chip thicknesses and allowing for multiple components, enhancing heat dissipation efficiency and preventing localized damage, thereby improving thermal management in electronic systems.
Implementation Method 1
the punching force causes cold flow of the material from areas of high pressure into areas of lower pressure
Implementation Method 2
heat generated by the chip 12 is discharged to the heat sink 18 via the heat spreader 20. The heat spreader 20 is able to disperse and spread the heat across the heat spreader 20
Data Source
AI summary
A heat spreader includes a top surface opposite a bottom surface, a first cavity formed within and extending upwardly from the bottom surface, the first cavity having a depth, a second cavity formed within and extending upwardly from the bottom surface, the second cavity having a depth, and wherein the first depth is greater than the second depth.