Heat Spreader Pillar Through-Hole Design
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Solution Overview
Problem
Conventional heat spreaders face issues with thermal resistance, reduced heat dissipation area, and decreased heat transfer efficiency due to loose attachment to heat sources and leakage of working fluid caused by copper pillars passing through the chamber.
Innovation Solution
A heat dissipation device with a main body featuring a chamber and support pillars, where a fixing hole is formed without damaging the chamber, allowing for tighter attachment to heat sources while maintaining airtightness and preventing fluid leakage, using a manufacturing method that includes preparing board bodies, adding capillary structures and support pillars, vacuuming, and sealing the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper pillars are arranged in four corners of the heat spreader, then assembling tightness is improved, but thermal resistance increases due to long distance from heat generation component
Solution Approach 1:
Instead of arranging support pillars only at the four corners of the heat spreader (conventional approach), the invention inverts the approach by positioning support pillars to extend from the heat generation component directly through the heat spreader, ensuring optimal thermal contact at the heat source location while maintaining structural stability.
2Loss of energy
If copper pillars are directly arranged near the heat generation component, then thermal resistance is reduced, but airtightness is compromised as pillars pass through the chamber
Solution Approach 1:
The invention introduces a through-hole structure that serves as an intermediary solution: the support pillar passes through a precisely formed through-hole in the heat spreader rather than directly through the chamber, allowing thermal contact while the chamber's airtight structure is preserved by routing the pillar through the board bodies.
3Reliability
If copper pillars pass through the chamber, then assembling tightness is improved, but heat transfer efficiency deteriorates due to interrupted working fluid flow
Solution Approach 1:
The through-hole structure acts as an intermediary that allows the support pillar to pass through the heat spreader board bodies without penetrating the chamber space. This maintains assembling tightness through direct support pillar contact while preserving the chamber's integrity and allowing uninterrupted working fluid flow for optimal heat transfer efficiency.
4Reliability
If fixing structure is added to heat spreader, then assembling tightness is improved, but heat dissipation area is reduced
Solution Approach 1:
The support pillars serve multiple functions simultaneously: they provide structural support for assembling tightness, enable direct thermal contact to reduce thermal resistance, and act as heat conduction paths. This multi-functionality eliminates the need for separate fixing structures that would reduce heat dissipation area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a tighter attachment to heat sources, preventing thermal resistance and fluid leakage, thus enhancing heat transfer efficiency and extending the device's lifespan.
Implementation Method 1
At least one capillary structure is disposed on a surface of the chamber
Implementation Method 2
Two ends of the support pillar are connected to the first and second sides of the chamber respectively
Data Source
AI summary
A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.