Integrated Heat Spreader With Oscillating Heat Pipe Cooling
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Solution Overview
Problem
Electronic and optoelectronic devices face challenges in managing thermal constraints due to increased device integration, leading to inefficient heat spreading and transport within packages.
Innovation Solution
A device incorporating an integrated heat spreader with at least one oscillating heat pipe, coupled with an optoelectronic component and a thermoelectric cooler, to enhance thermal management by facilitating efficient heat transfer and circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device integration is increased to improve computing power and network capacity, then device performance is improved, but thermal constraints worsen due to inefficient heat spreading and transport within packages
Solution Approach 1:
The heat spreader is segmented into multiple functional zones including an evaporator region with channels, an adiabatic region, and a condenser region. This segmentation allows different parts of the heat spreader to perform specialized functions (evaporation, adiabatic transition, condensation) thereby improving overall heat transport efficiency while managing thermal constraints in high-power devices
Solution Approach 2:
The invention utilizes phase transitions of a working fluid within the oscillating heat pipe channels. The fluid undergoes cyclic evaporation in the evaporator region and condensation in the condenser region, leveraging latent heat transfer to efficiently move thermal energy from hot spots to heat sinks, thereby addressing thermal constraints without compromising device integration density
2Productivity
If conventional heat spreading methods are used, then device integration is improved, but heat transport efficiency deteriorates due to high thermal resistance within packages
Solution Approach 1:
The invention employs fluid dynamics within the oscillating heat pipe channels to transport heat. The working fluid circulates through the channels utilizing pressure gradients generated by phase change, enabling active heat pumping action that overcomes thermal resistance barriers in packaged devices, thereby improving heat transport efficiency while maintaining device integration
Solution Approach 2:
The invention changes the thermal management approach by transitioning from passive conduction to active two-phase flow heat transport. By modifying the physical state and flow parameters of the working fluid within the channels, the system achieves superior heat transport efficiency that overcomes the limitations of conventional solid-state heat spreading in integrated packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses thermal constraints by improving heat spreading and transport, reducing temperature differentials, and minimizing cooling power requirements, thereby enhancing device performance and reliability.
Implementation Method 1
at least one oscillating heat pipe arranged between the first side and the second side, at least one (i.e. one or more, optionally each) of the at least one oscillating heat pipe comprising a plurality of interconnected channels comprising a working fluid
Implementation Method 2
a heat spreader comprising at least one oscillating heat pipe arranged between the first side and the second side
Implementation Method 3
at least one thermoelectric cooler, wherein a cold side of the at least one thermoelectric cooler is coupled to the second side of the heat spreader
Data Source
AI summary
A device, and method of operating the device, are disclosed. The device includes: a heat spreader having a first side and a second side opposite the first side, the heat spreader including at least one oscillating heat pipe arranged between the first side and the second side, at least one of the at least one oscillating heat pipe including a plurality of interconnected channels including a working fluid; at least one optoelectronic component coupled to the first side of the heat spreader; and at least one thermoelectric cooler, wherein a cold side of the at least one thermoelectric cooler is coupled to the second side of the heat spreader. The heat spreader may include one or more heat exchange features.