Heat Spreader with Pressure Clip for AMB Thermal Management

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Solution Overview

Problem

Conventional heat spreaders for fully buffered DIMM (FBDIMM) modules have insufficient thermal characteristics and a complex attachment process, leading to inefficient heat dissipation and reduced operational reliability due to high heat generation in the advanced memory buffer (AMB) hub.

Innovation Solution

A heat spreader with a heat sinking plate and pressure clip design, featuring a spine, ribs, and hook parts, allowing for efficient heat radiation and easy attachment to the AMB with a one-touch method, facilitating automated assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional heat spreader is used, then the structure is simple, but the thermal characteristics are insufficient and heat dissipation is inefficient

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat spreader structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat spreader is divided into multiple functional components: a plate body for heat conduction, protrusions for contact with the heat source, and grooves for attachment. This segmentation allows each part to be optimized for its specific function, improving overall thermal performance while maintaining manufacturing simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat spreader transitions from a conventional two-dimensional plate to a three-dimensional structure with protrusions extending toward the heat source. This dimensional change increases the heat transfer surface area and improves thermal contact without significantly increasing overall complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a conventional attachment process is used, then the heat spreader can be attached, but the process is complex and not suitable for automated assembly

Engineering Contradiction:

Improveattachment process simplicityVSAvoidassembly automation capability

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The heat spreader incorporates self-aligning protrusions and grooves that automatically mate during attachment. The protrusions fit into corresponding grooves on the heat source, providing self-positioning and self-alignment that eliminates complex attachment procedures and enables automated assembly.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The attachment mechanism uses elastic deformation of the plate body to provide snap-fit attachment. The plate can be elastically deformed during attachment and then returns to its original shape, creating a secure mechanical bond without requiring additional fasteners or complex procedures.

Inventive Principle:

Principle #35Parameter changes

3Length of stationary object

If the heat spreader plate is made thinner to meet standards, then international thickness standards are met, but thermal conductivity may be reduced

Engineering Contradiction:

Improveheat spreader thicknessVSAvoidoperational reliability

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The heat spreader uses a composite structure combining a thin plate body with high-thermal-conductivity material and protrusions that extend into the heat source. This composite design maintains overall thinness while concentrating thermal conduction pathways through the protrusions, achieving both thickness requirements and thermal performance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The plate body is designed with non-uniform thickness, being thinner in most areas but with localized thicker protrusions that contact the heat source. This local quality variation allows the overall component to meet thickness standards while maintaining adequate thermal conductivity at critical heat transfer points.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat spreader effectively dissipates heat from the AMB, improving the operational reliability and lifespan of FBDIMM modules by enhancing thermal conductivity and simplifying the attachment process, while meeting international thickness standards.

Implementation Method 1

a heat sinking plate (110) which radiates heat of a heat source

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat sinking plate (110) which radiates heat of a heat source

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7518873B2Heat spreader, semiconductor package module and memory module having the heat spreader

Publication Date: 2009.04.14 SAMSUNG ELECTRONICS CO LTD

AI summary

A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.