Heat Spreader Projection for Thin Semiconductor Strength

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Solution Overview

Problem

Conventional semiconductor devices require thick wiring substrates and heat dissipation plates for mechanical strength, limiting the reduction in thickness and efficiency of heat dissipation.

Innovation Solution

A semiconductor device design featuring a wiring substrate, a semiconductor element, a heat dissipation plate with projections, and an encapsulation resin that covers the heat dissipation plate and wiring substrate, allowing for a thinner device while maintaining mechanical strength and efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the wiring substrate and heat dissipation plate are made thick to ensure mechanical strength, then the mechanical strength is improved, but the overall thickness of the semiconductor device increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidoverall thickness

Core Design Contradiction:

StrengthVSLength of stationary object

Solution Approach 1:

The heat dissipation plate is segmented into a body portion and a projection portion. The projection extends downward from the body and is positioned to provide mechanical support to the wiring substrate, while the body provides heat dissipation surface area. This segmentation allows thinning of individual components while maintaining overall mechanical strength through the distributed support structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The projection of the heat dissipation plate extends in the vertical dimension (downward toward the wiring substrate) rather than only in the horizontal plane. This vertical extension provides mechanical support in the thickness direction, enabling the use of thinner horizontal layers while maintaining structural integrity through the protruding support element.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Length of stationary object

If the heat dissipation plate is made thinner to reduce device thickness, then the overall thickness is reduced, but the mechanical strength decreases

Engineering Contradiction:

Improveoverall thicknessVSAvoidmechanical strength

Core Design Contradiction:

Length of stationary objectVSStrength

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The projection of the heat dissipation plate acts as an intermediary mechanical support element between the heat dissipation body and the wiring substrate. It transfers and distributes mechanical loads, providing structural reinforcement without requiring the entire heat dissipation plate to be thick.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If the heat dissipation plate surface area is increased to improve heat dissipation, then the heat dissipation efficiency is improved, but the device footprint increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice footprint

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The heat dissipation plate utilizes the vertical dimension by extending a projection downward from the body. This vertical extension increases the effective heat dissipation surface area and improves thermal contact with the wiring substrate without increasing the horizontal footprint of the device.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation plate is designed as a thin-film structure with a projection, maximizing heat dissipation surface area relative to the horizontal footprint. The thin body provides sufficient thermal conduction path while the projection extends the effective heat transfer area vertically.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces the overall thickness of the semiconductor device, enhances mechanical strength, and improves heat dissipation by exposing a larger surface area of the heat dissipation plate for efficient heat transfer, while minimizing manufacturing complexity and costs.

Implementation Method 1

The heat dissipation plate is thermally coupled to a semiconductor element mounted on a wiring substrate by an adhesive

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat is transmitted to the heat dissipation plate through the adhesive and then to the atmospheric air from the heat dissipation plate

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

the heat is transmitted to the heat dissipation plate through the adhesive and then to the atmospheric air from the heat dissipation plate

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9666506B2Heat spreader with wiring substrate for reduced thickness

Publication Date: 2017.05.30 SHINKO ELECTRIC IND CO LTD

AI summary

A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a heat dissipation plate arranged on an upper surface of the semiconductor element with an adhesive arranged in between, and an encapsulation resin filling a gap between the heat dissipation plate and the wiring substrate. The heat dissipation plate includes a body and a projection. The body is overlapped with the semiconductor element in a plan view and has a larger planar shape than the semiconductor element. The projection is formed integrally with the body. The projection projects outward from an end of the body and is located below the body. The encapsulation resin covers upper and lower surfaces of the projection. The body includes an upper surface exposed from the encapsulation resin.