Heat Spreader Ground Coupling for Package Radiation Shielding
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Solution Overview
Problem
Current radiation shielding technologies for electronic devices, particularly in SoC packages, face challenges in effectively containing electromagnetic interference (EMI) and radio-frequency interference (RFI) due to increased computing density, leading to performance issues and mechanical constraints such as package cost and size limitations, which existing solutions like conductive coatings and on-board shielding cannot adequately address.
Innovation Solution
A radiation shield system is implemented by securing a ground coupling mechanism on a heat spreader to a substrate, creating a Faraday cage effect that shields EMI and RFI through a combination of spring tips, bendable fingers, or conductive gaskets, which are mechanically compliant and can be manufactured using high-volume processes, allowing for effective shielding without compromising thermal contact or increasing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional radiation shielding methods (conductive coatings, on-board shielding) are used, then some level of EMI/RFI protection is achieved, but shielding effectiveness is insufficient for high computing density systems
Solution Approach 1:
The radiation shield is integrated within the package substrate itself, nesting the shielding function inside the existing package structure. The shield forms an enclosed cavity that contains the die, creating a nested configuration where the shield is embedded within the package rather than being an external addition.
Solution Approach 2:
The radiation shield utilizes a conductive material layer (such as metal) deposited on the inner surface of the package substrate, creating a composite structure that combines the mechanical support function of the substrate with the electromagnetic shielding function of the conductive layer.
2Object-affected harmful factors
If radiation shielding structures are added to contain EMI/RFI, then shielding effectiveness improves, but package size and complexity increase
Solution Approach 1:
The package substrate serves multiple functions: it provides mechanical support for the die, acts as the radiation shielding barrier through the integrated conductive layer, and maintains electrical connections. This multi-functionality eliminates the need for separate shielding components, reducing overall package complexity.
Solution Approach 2:
The shielding function is merged with the package substrate structure itself. The conductive material is deposited directly on the substrate's inner surface, combining the substrate's structural role with the shield's protective role into a single integrated component.
3Object-affected harmful factors
If radiation shields are implemented around components, then EMI/RFI shielding improves, but thermal dissipation performance may deteriorate
Solution Approach 1:
The conductive shielding layer is applied selectively on the inner surface of the package substrate, with specific attention to areas where EMI/RFI protection is most needed while maintaining thermal pathways. The shielding can be patterned or selectively applied to preserve thermal management performance in critical regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced shielding effectiveness while maintaining thermal performance and structural integrity, addressing the limitations of existing technologies by effectively containing radiation and reducing interference impacts on electronic devices.
Implementation Method 1
creating a Faraday cage effect that shields EMI and RFI
Implementation Method 2
a heat spreader coupled to the component and secured to the substrate
Data Source
Figure 1
Figure 2A~2D
Figure 2E~2F
AI summary
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.