Heat Spreader RDL Structure for Chip Stack Power and Cooling
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving effective heat dissipation and power delivery due to the limitations of conventional thermal management and power delivery structures, particularly in high-density chip stacks, which affect performance and reliability.
Innovation Solution
Integration of a redistribution layer (RDL) made of high thermal conductive dielectric material on a heat spreader, combined with an organic laminate substrate, to enhance power delivery and thermal management by routing power and ground signals while dissipating heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional thermal management structures are used in high-density chip stacks, then device miniaturization is achieved, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The patent introduces a redistribution layer (RDL) structure that extends thermal management into the vertical dimension by routing heat dissipation paths through the organic laminate substrate from both top and bottom sides of the chip stack, transforming conventional single-sided cooling into multi-dimensional heat removal
Solution Approach 2:
The patent employs composite material construction by integrating the RDL with the organic laminate substrate, combining materials with different thermal conductivities to create optimized thermal pathways that enhance overall heat dissipation effectiveness while maintaining electrical functionality
2Device complexity
If conventional power delivery structures are used, then device complexity is reduced, but power delivery efficiency deteriorates
Solution Approach 1:
The patent segments the power delivery function by separating power routing from ground routing into distinct RDL layers, allowing independent optimization of each pathway and enabling more efficient power delivery through dedicated conductive paths
Solution Approach 2:
The RDL structure serves multiple functions simultaneously: it provides power delivery, ground return paths, and thermal management, consolidating what would traditionally require separate structures into a single integrated solution that improves efficiency without proportionally increasing complexity
3Temperature
If high thermal conductive materials are used in RDL, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies material parameters by selecting dielectric materials with specific thermal conductivity characteristics for the RDL, changing the thermal parameter of the packaging structure to enhance heat dissipation while maintaining compatibility with existing manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient power delivery and thermal management, improving the performance and reliability of high-density chip stacks by effectively routing signals and dissipating heat from both the top and bottom sides of the chips.
Implementation Method 1
a redistribution layer (RDL) of high thermal conductive material disposed overlying the IC chip and overlying at least one of the spaced apart raised laminate portions
Implementation Method 2
a heat spreader layer disposed on a top surface of the RDL layer for receiving, distributing and dissipating heat from the top surface of the RDL
Implementation Method 3
dissipating heat from the top surface of the RDL
Implementation Method 4
the organic laminate substrate including conductive connectors at a surface of the cavity and at a surface of one of the raised laminate portions for carrying signals
Data Source
AI summary
A semiconductor package includes a substrate such as an organic laminate substrate having conductors for carrying signals and includes an integrated circuit (IC) chip, e.g., a 3-dimensional flip-chip IC stack mounted thereon. The flip-chip is electrically connected to exposed conductors at the organic laminate substrate for receiving power signals and ground therefrom. A thermally conductive heat spreader with a redistribution layer (RDL) of high thermal conductive material for power delivery and heat spreading is connected to a top surface of the IC chip. In an example, the RDL can electrically connect with the laminate below the chip and at the peripheral of the chip. The thermally conductive heat spreader structure is disposed on top the RDL layer for receiving, distributing and dissipating heat from a top surface of the RDL. The package enables improved power delivery, heat spreading and heat removal from a top side of the IC chip.