Heat Spreader for Resistive Elements

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Solution Overview

Problem

Resistive elements in electronic systems face challenges with inadequate heat dissipation, particularly in small form factors, leading to potential failure due to excessive heat and changes in resistivity, especially in high-current or pulsed applications.

Innovation Solution

A heat spreader assembly is introduced, comprising a body portion over the resistive element and leg portions extending to a heat sink, with thermal interface material for efficient heat transfer, ensuring electrical insulation and enhanced heat dissipation capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the physical size of electrical components is decreased to reduce system size, then the dimensions of components are reduced, but the heat dissipation capability deteriorates

Engineering Contradiction:
Improvecomponent sizeVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The heat spreader extends the heat dissipation path from the traditional bottom-only contact to include top and side surfaces, effectively utilizing three-dimensional space for heat transfer. The spreader structure projects laterally from the component body, creating additional thermal contact areas with the heat sink in multiple directions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat spreader is divided into multiple functional segments: a body portion that contacts the component housing, leg portions that extend to the heat sink, and intermediate portions that facilitate heat transfer. This segmentation allows each part to optimize its specific function while collectively solving the heat dissipation problem.

Inventive Principle:
Principle #1Segmentation

2Temperature

If resistive elements are mounted to heat sinks for heat dissipation, then heat transfer is improved, but hot spots in the center of the resistive element still occur

Engineering Contradiction:
Improveheat transferVSAvoidhot spot formation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat spreader introduces a third dimension of heat dissipation by extending upward from the component housing to contact the resistive element's top surface and sides. This vertical extension creates additional thermal pathways that bypass the traditional bottom-only heat transfer route, effectively distributing heat away from the center hot spots.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat spreader acts as an intermediary thermal conductor between the resistive element and the heat sink. It provides a dedicated thermal pathway that intermediates the heat transfer process, allowing heat to be conducted from multiple surfaces of the resistive element through the spreader to the heat sink, thereby reducing thermal concentration.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If thermal contact between resistive element and heat sink is increased, then heat dissipation is improved, but electrical conduction may occur causing short circuits

Engineering Contradiction:
Improveheat dissipationVSAvoidelectrical insulation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat spreader serves as a thermal intermediary that is electrically isolated from the resistive element. It provides the necessary thermal contact with the heat sink while maintaining electrical insulation through its positioning and material properties, preventing short circuits while enabling efficient heat transfer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal management system is segmented into electrically isolated components: the resistive element, the insulating housing, the heat spreader, and the heat sink. This segmentation allows thermal contact between non-adjacent components (resistive element and heat sink) while maintaining electrical insulation through the intermediate housing and spreader structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat spreader significantly increases heat dissipation from resistive elements, reducing temperature rise and maintaining performance across varying power levels, while maintaining mechanical integrity and compatibility with existing systems.

Implementation Method 1

leg portions that extend from the body portion and are associated with the heat sink in a thermally conductive relationship

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a thermal interface material sandwiched between the body portion and the top surface of the resistive element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The heat spreader significantly increases heat dissipation from resistive elements

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP2705530B1Heat spreader for electrical components
Publication Date: 2018.07.04 VISHAY DALE ELECTRONICS INC
  • EP2705530B1 patent drawingFigure 1~2
  • EP2705530B1 patent drawingFigure 3~4
  • EP2705530B1 patent drawingFigure 5~6

AI summary

A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.