Semiconductor Heat Spreader With Integrated Shielding and Antenna Paths
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Solution Overview
Problem
Integrating antenna elements into semiconductor device packages poses challenges in thermal management, as standard heat sinks block signal paths and customized structures compromise heat dissipation efficiency, while miniaturization and RF/EMI shielding requirements are not adequately met in existing solutions.
Innovation Solution
A selectively-plated thermal dissipation structure with integrated RF/EMI shielding and antenna elements is formed using a heat spreader element that is etched to create openings and structures for efficient heat dissipation and signal transmission, allowing close contact between the semiconductor die and the heat spreader, and incorporating mold compound to optimize package thickness and RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a standard heat sink is used to provide thermal dissipation, then heat dissipation efficiency is improved, but the antenna signal path is blocked
Solution Approach 1:
The heat spreader is segmented into multiple regions: a first region with enhanced heat dissipation structures (fins, pins, or protrusions) and a second region that is substantially planar to avoid blocking antenna signals. This segmentation allows different parts of the heat spreader to serve different functions - thermal management in the first region and signal transmission in the second region.
Solution Approach 2:
Different regions of the heat spreader are given different local qualities: the first region has increased surface area and complex structures optimized for heat dissipation, while the second region maintains a smooth, planar surface optimized for antenna signal transmission. This local differentiation resolves the contradiction by applying the appropriate structure in the appropriate location.
2Object-affected harmful factors
If a customized heat sink structure with openings is provided to open the window above the antenna region, then antenna signal transmission is improved, but device assembly complexity increases and heat sink effectiveness is reduced
Solution Approach 1:
The heat spreader is divided into functional zones during the forming process itself, with the second region designed as a substantially planar surface from the outset. This eliminates the need for post-assembly modifications or complex multi-step assembly procedures, as the antenna-friendly region is built-in rather than added later.
Solution Approach 2:
The heat spreader serves multiple functions simultaneously: it provides thermal dissipation through the first region's structures while the second region's planar surface provides an unobstructed path for antenna signals. This multi-functionality is achieved through a single integrated component design rather than multiple separate parts.
3Loss of energy
If antenna elements are integrated into the semiconductor device package, then signal loss is reduced, but thermal management becomes more difficult
Solution Approach 1:
The heat spreader is segmented into a first region for aggressive heat dissipation and a second planar region for antenna signal transmission. This allows the antenna to be positioned close to the semiconductor die (reducing signal loss) while the heat spreader's first region provides effective thermal management through enhanced dissipation structures.
Solution Approach 2:
The heat dissipation function is extended into the vertical dimension with fins, pins, or protrusions that increase surface area without increasing the horizontal footprint. This allows effective heat management in a compact form factor that doesn't interfere with the antenna's horizontal signal path.
4Length of moving object
If the package thickness is reduced for miniaturization, then device size is improved, but heat dissipation capability is compromised
Solution Approach 1:
Heat dissipation is enhanced by extending structures vertically (fins, pins, protrusions) rather than increasing horizontal dimensions. This allows the package to remain thin in the horizontal plane while providing substantial heat dissipation surface area through vertical extensions, resolving the contradiction between miniaturization and thermal management.
Solution Approach 2:
The heat spreader is segmented into regions with different thermal management characteristics, allowing optimized heat dissipation in the first region while maintaining an overall compact form factor. The segmented design enables efficient heat management without requiring increased package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective thermal dissipation and RF signal transmission with reduced package thickness, improved heat spreading, and integrated RF/EMI shielding, addressing the limitations of existing technologies by allowing for thin semiconductor device dies and efficient heat management without compromising antenna performance.
Implementation Method 1
A first portion of a first major surface of a heat spreader element is thermally coupled to an exposed surface of a semiconductor device die
Implementation Method 2
integrated RF/EMI shielding
Data Source
AI summary
A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.