Aligned Heat Spreader Stack for Wireless PCB Assembly and Cooling
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Solution Overview
Problem
Existing wireless communication devices face challenges in efficient heat dissipation and assembly complexity, leading to performance limitations and increased manufacturing time.
Innovation Solution
The use of a stacked heat spreader design with alignment features, including locating pins and alignment pins, to facilitate efficient heat dissipation and simplify assembly by aligning and securing components such as PCBs, power boards, and heat spreaders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional wireless communication devices are designed with multiple components (PCB, power board, heat spreaders), then functional requirements can be met, but assembly complexity increases and manufacturing time increases
Solution Approach 1:
The patent combines multiple separate components (PCB, power board, heat spreaders) into a single integrated assembly where the PCB and power board are electrically and mechanically connected, reducing the number of discrete parts that need to be assembled separately
Solution Approach 2:
The integrated assembly serves multiple functions simultaneously - the PCB provides both structural support and electrical connectivity, the power board provides both power distribution and thermal management, and the heat spreaders provide both thermal conduction and mechanical alignment, reducing the need for separate dedicated components
2Manufacturing precision
If traditional wireless communication devices use separate components without alignment features, then design flexibility is maintained, but assembly precision deteriorates and alignment accuracy is poor
Solution Approach 1:
The alignment features (protrusions and recesses) are designed to automatically guide and position components during assembly without requiring external alignment tools or complex positioning mechanisms, allowing the components to self-align through their inherent geometric features
Solution Approach 2:
The alignment features use asymmetric geometries (specific protrusion-recess combinations) that provide directional guidance and prevent incorrect orientation of components, ensuring precise alignment through unique fitting patterns that only work in the correct orientation
3Temperature
If wireless communication devices do not have optimized heat dissipation structures, then device compactness is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The heat spreaders are positioned between the PCB and power board in the vertical dimension, utilizing the z-axis space for thermal management rather than expanding the device footprint in the x-y plane, allowing effective heat dissipation without increasing overall device volume
Solution Approach 2:
The heat spreaders act as thermal intermediaries between the heat-generating components (PCB and power board), conducting heat away from critical areas and distributing it across larger surface areas for more effective dissipation through convection and radiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and simplifies assembly, resulting in compact, efficient, and easily manufacturable wireless communication devices.
Implementation Method 1
heat spreaders and printed circuit board (PCB) components that form a main body of a wireless communication device
Data Source
AI summary
A wireless communication device may include a first heat spreader including at least two main locating pins extending axially away from an inward-facing surface of the first heat spreader, a printed circuit board (PCB) adjacent to the first heat spreader, a second heat spreader adjacent to the PCB, a power board adjacent to the second heat spreader, and a third heat spreader adjacent to the power board. The third heat spreader may be secured to the at least two main locating pins to assemble the first heat spreader, PCB, second heat spreader, power board, and third heat spreader together. Various other devices and methods are related to such wireless communication devices.