Heat Spreader Stacking Stand-off Prevents Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for packaging integrated circuits with heat spreaders often result in sticking issues during assembly, leading to malfunctions, productivity loss, and damage to equipment, due to the identical contours and surface finishes of the heat spreaders, which causes them to adhere together, affecting the reliability and efficiency of the assembly process.
Innovation Solution
The integration of a stacking stand-off feature on the heat spreader, which creates a gap between individual heat spreaders in the stack, preventing them from sticking together, and using position support features to align and secure the heat spreaders properly, reducing the need for excessive adhesive and ensuring proper spacing and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat spreaders are stacked closely together for storage and assembly, then storage space is reduced, but the heat spreaders stick together causing assembly malfunctions
Solution Approach 1:
The patent introduces a vertical dimension to the stacking problem by forming protrusions that extend upward from the heat spreader body. This allows heat spreaders to be stacked closely in horizontal space while the protrusions create vertical separation gaps that prevent sticking, thus resolving the contradiction between compact storage and assembly reliability.
2Productivity
If heat spreaders are stacked with tight spacing to reduce storage volume, then storage efficiency improves, but the duplicate contours cause the heat spreaders to stick together
Solution Approach 1:
The patent segments the contact surface of the heat spreader by forming discrete protrusions at specific locations rather than having a continuous contact surface. This segmentation creates isolated contact points separated by gaps, preventing the duplicate contour surfaces from adhering together while maintaining compact stacking.
Solution Approach 2:
The protrusions act as intermediary elements between the heat spreader bodies. They provide controlled contact points for stacking while their elevated position creates air gaps that prevent direct surface-to-surface contact, thereby eliminating the sticking problem caused by duplicate contours.
3Productivity
If the assembly line operates continuously without interruptions, then productivity is maximized, but sticking heat spreaders cause malfunctions and stoppages
Solution Approach 1:
The protrusions are formed on the heat spreaders during the stamping or forging process, before the heat spreaders reach the assembly line. This preliminary action ensures that the anti-sticking features are already in place, preventing sticking issues before they can disrupt assembly line continuity and maintain maximum productivity.
4Device complexity
If heat spreaders are stacked without separation features, then the stacking process is simple, but the weight of the stack bends lower devices causing locking of forms
Solution Approach 1:
The stacking stand-off feature segments the stack into discrete, supported levels. Each heat spreader is supported at its protrusions, distributing the stack weight through multiple contact points rather than allowing the entire weight to bend lower devices, thus preventing deformation while maintaining a simple stacking process.
Data Source
AI summary
An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.