Heat Spreader Structure With Through-Hole Extensions for Dense Packaging
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Solution Overview
Problem
Conventional heat spreaders face challenges in efficiently dissipating heat due to increasing density of electronic components in semiconductor packages, often lacking sufficient space for mounting and inadequate heat dissipation performance.
Innovation Solution
A heat spreader design featuring a body with non-peripheral holes and extensions that extend from the top surface to the bottom, allowing for secure attachment and improved heat dissipation without occupying additional substrate space, with the extensions being integrally formed and adjustable to fit various semiconductor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat spreader is attached onto a substrate via its foot portion, then the heat spreader can be mounted securely, but a mounting space is required on the substrate which reduces the space available for mounting additional components
Solution Approach 1:
The heat spreader transitions from a two-dimensional foot portion attachment to a three-dimensional attachment by extending fingers downward through holes in the body to engage the semiconductor component from below, eliminating the need for substrate mounting space while maintaining secure attachment
Solution Approach 2:
The fingers are nested within holes in the heat spreader body, with the fingers extending through the holes to engage the semiconductor component, creating a nested structure that secures the component without requiring additional substrate space
2Adaptability or versatility
If additional components are mounted on the substrate surrounding the die, then more functionality is achieved, but there may not be enough space on the substrate for mounting the heat spreader anymore
Solution Approach 1:
The attachment mechanism moves from the substrate plane to the vertical dimension by extending fingers through the heat spreader body to engage the semiconductor component, allowing the heat spreader to be mounted without occupying substrate space and enabling greater component integration density
3Productivity
If the heat dissipation density increases due to higher electronic component density, then more heat needs to be dissipated, but conventional heat spreaders are unlikely to fulfill the growing demands
Solution Approach 1:
The heat spreader body contains multiple holes with fingers extending through them, creating a porous-like structure that increases the surface area for heat dissipation while maintaining a compact form factor, enabling the heat spreader to handle higher heat dissipation demands
Solution Approach 2:
The fingers are pre-formed within the holes and can be bent outward to engage the semiconductor component, ensuring proper thermal contact is established before operation, which optimizes heat dissipation performance from the outset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance while allowing for more components to be mounted on the substrate, as the heat spreader can be securely attached to semiconductor components without occupying substrate space, effectively addressing the limitations of conventional heat spreaders.
Implementation Method 1
a body having a bottom surface to be in thermal contact with the semiconductor component
Data Source
AI summary
A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.