Heat Spreader Array for IC Package Thermal Management
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Solution Overview
Problem
Conventional integrated circuit packaging methods face challenges in efficiently conducting heat away from the die due to high thermal resistance and reliability issues caused by poor thermal transfer, especially with individual metal lids and mold compound, which are inefficient for mass production and prone to overheating.
Innovation Solution
A method and apparatus for fabricating integrated circuit chips with thermally enhanced compression mold packages featuring an array of stamped or etched metal heat spreaders that make direct thermal contact with the chips, eliminating the need for a lower mold cavity tool and optimizing heat dissipation through recessed pedestal structures and perimeter reservoirs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If individual metal lids or heat spreaders are separately applied to individual packaged units, then heat dissipation is provided, but manufacturing efficiency decreases and device complexity increases
Solution Approach 1:
The patent combines multiple individual heat spreaders into a single array structure that can be applied to multiple packaged units simultaneously. This array of heat spreaders is attached to a carrier substrate, allowing one unified component to serve the thermal management needs of multiple integrated circuit packages, thereby improving manufacturing efficiency while maintaining effective heat dissipation.
Solution Approach 2:
The heat spreader array serves multiple functions: it provides thermal management for multiple packaged units simultaneously, acts as a support structure during the molding process, and enables efficient heat transfer across the array. This multi-functional design eliminates the need for separate heat spreader application steps for each unit.
2Temperature
If individual metal lids or heat spreaders are separately applied to individual packaged units, then heat dissipation is provided, but package size increases
Solution Approach 1:
By merging multiple heat spreaders into a single array structure that spans across multiple packaged units, the patent eliminates the need for additional space that would be required if separate heat spreaders were applied to each unit. The shared array structure optimizes space utilization and reduces overall package footprint.
3Reliability
If mold compound is formed between the die and heat spreader, then encapsulation is provided, but thermal resistance increases
Solution Approach 1:
The patent applies a thermally conductive interface material to the heat spreader array before the mold compound is formed. This preliminary action ensures that when the mold compound encapsulates the die and heat spreader, there is already an optimized thermal pathway in place, minimizing thermal resistance while maintaining the encapsulation benefits of the mold compound.
Solution Approach 2:
The thermally conductive interface material acts as an intermediary between the die and the heat spreader array. This intermediary layer improves thermal transfer efficiency compared to direct contact with mold compound, while still allowing the mold compound to provide its encapsulation and protective functions.
4Ease of manufacture
If conventional packaging methods are used, then manufacturing is simplified, but power dissipation capability is limited
Solution Approach 1:
The patent merges multiple heat spreaders into a unified array structure that can be manufactured and applied as a single component. This approach maintains manufacturing simplicity by reducing the number of separate assembly steps while dramatically improving power dissipation capability through the combined thermal management of multiple units simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance, enhances heat dissipation, and improves packaging reliability by allowing direct thermal contact between the die and heat spreaders, doubling the power dissipation capability of integrated circuit packages compared to conventional methods while maintaining low profile and high array density.
Implementation Method 1
a heat spreader array which makes direct thermal contact with the plurality of integrated circuit chips... reduces thermal resistance, enhances heat dissipation
Data Source
AI summary
A method and apparatus are provided for manufacturing a lead frame based thermally enhanced package (9) with exposed heat spreader lid array (96) designed to be optimized for compression mold encapsulation of an integrated circuit die (94) by including a perimeter reservoir regions (97r) in each heat spreader lid (96) for movement of mold compound (98) displaced during the mold compression process.