Semiconductor Package Heat Spreader Surface Roughness
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Solution Overview
Problem
Current semiconductor packages face challenges in efficiently managing heat and mechanical stability, particularly as device sizes shrink, with existing heat spreader designs often leading to adhesion failures and inefficient heat transfer.
Innovation Solution
A semiconductor package design featuring a heat spreader with a surface roughness difference between its top and bottom surfaces, an adhesive film with thermosetting material, and through-holes to facilitate bonding and heat dissipation, while maintaining mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat spreader is used to improve heat transfer efficiency, then heat dissipation performance is improved, but adhesion failures occur between the heat spreader and semiconductor chip
Solution Approach 1:
The heat spreader is designed with different surface roughness values on its first surface (facing the semiconductor chip) and second surface (opposite side). Specifically, the surface roughness of the first surface is controlled to be between 0.1-1.0 μm, while the second surface has a roughness of 1.5-3.0 μm. This local differentiation allows the first surface to maintain strong adhesion to the semiconductor chip while the second surface provides enhanced bonding to the molding layer, thereby preventing adhesion failures while maintaining heat transfer efficiency.
2Volume of moving object
If the package size is reduced to meet miniaturization requirements, then device compactness is improved, but mechanical stability and heat management become more difficult
Solution Approach 1:
The invention controls specific surface roughness parameters of the heat spreader to optimize both mechanical stability and heat management in miniaturized packages. By precisely controlling the surface roughness of the first surface to 0.1-1.0 μm and the second surface to 1.5-3.0 μm, the design ensures adequate bonding strength and mechanical stability even as the overall package size is reduced for miniaturization.
3Strength
If the surface roughness of the heat spreader is increased to improve bonding strength, then adhesion is improved, but heat transfer efficiency may be reduced
Solution Approach 1:
The heat spreader implements differentiated surface roughness across its two surfaces: the first surface (contacting the semiconductor chip) maintains a smoother finish with roughness of 0.1-1.0 μm to optimize thermal contact and heat transfer, while the second surface (contacting the molding layer) has a rougher finish with roughness of 1.5-3.0 μm to enhance mechanical bonding strength. This local quality differentiation resolves the contradiction between bonding strength and heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances bonding strength, prevents adhesion failures, and improves heat transfer efficiency, reducing package thickness and warpage while maintaining durability at high temperatures.
Implementation Method 1
an adhesive film between the semiconductor chip and the heat spreader
Implementation Method 2
a heat spreader on the semiconductor chip... improves heat transfer efficiency
Data Source
AI summary
A semiconductor package includes a semiconductor chip on a package substrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film between the semiconductor chip and the heat spreader, and a through-hole passing through the heat spreader. The heat spreader includes a first surface and a second surface. The molding layer covers sidewalls of the semiconductor chip and the heat spreader and exposes the first surface of the heat spreader. The adhesive film is on the second surface of the heat spreader.