Heat-Spreading Chip Package Structure for Hot Spot Dissipation
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Solution Overview
Problem
As semiconductor chips continue to shrink, they generate more heat, making it challenging to develop packages with effective heat dissipation performance.
Innovation Solution
A chip package structure is formed by creating a heat-spreading substrate with a high thermal conductivity substrate and conductive plug structures, which is bonded between chip structures to laterally spread heat away from hot spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If feature size continues to decrease to increase functional density, then production efficiency is improved and costs are lowered, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a heat-spreading substrate as an intermediary component between the chip structure and the package substrate. This substrate has higher thermal conductivity than the chip structure, acting as a thermal mediator to conduct heat away from the chip. The heat-spreading substrate includes conductive plug structures that extend through the substrate to facilitate heat transfer to external heat sinks, effectively resolving the heat dissipation problem while maintaining the benefits of small feature sizes
Solution Approach 2:
The patent employs composite material structures, particularly the heat-spreading substrate that combines materials with different thermal conductivities. The substrate itself has regions with varying thermal conductivity, and the conductive plug structures use materials specifically selected for high thermal conductivity. This composite approach allows optimization of heat spreading in different directions and layers, addressing the heat generation issue without compromising the scaled-down chip design
2Reliability
If heat is not effectively dissipated, then chip performance degrades and reliability decreases, but adding heat dissipation structures increases package complexity
Solution Approach 1:
The heat-spreading substrate performs multiple functions simultaneously: it provides mechanical support for the chip structure, facilitates heat dissipation through its high thermal conductivity regions and conductive plugs, and serves as a platform for electrical connections through its bonding pads. By combining these functions in a single component, the patent improves reliability without proportionally increasing package complexity
Solution Approach 2:
The patent merges the heat dissipation function with the existing substrate structure. The conductive plug structures are integrated into the substrate rather than being separate components, and the bonding pads serve both electrical connection and thermal management purposes. This merging approach allows effective heat dissipation while maintaining relatively simple package architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the reliability and performance of the chip package by effectively dissipating heat, preventing accumulation at hot spots and thus reducing the risk of damage to the chip structures.
Implementation Method 1
a first thermal conductivity of the substrate is higher than a second thermal conductivity of the first chip structure... the heat-spreading substrate contacts with the first chip structure and the second chip structure
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a first chip structure. The chip package structure includes a heat-spreading substrate over the first chip structure. The chip package structure includes a second chip structure over the heat-spreading substrate. The second chip structure is electrically connected to the first chip structure through the conductive plug structure, the first thermal conductivity of the substrate is higher than a third thermal conductivity of the second chip structure, and the heat-spreading substrate is in direct contact with the first chip structure and the second chip structure.