Heat Spreading Lid Layout for Thin-Film Thermoelectric Interfaces
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Solution Overview
Problem
Thin film thermoelectric devices face higher thermal resistance and mechanical fragility compared to bulk-type modules, leading to increased power consumption and inadequate cooling due to higher thermal resistance of the thermal interface material and vulnerability to mechanical loading.
Innovation Solution
A thermoelectric heat exchanger component with a heat spreading lid that optimizes thermal interface resistance by minimizing the thickness of the thermal interface material through adjustable orientation and the use of pedestals and lips to ensure even mechanical support, reducing thermal interface resistance and protecting the devices from mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin film thermoelectric devices are used to reduce size, then device dimensions are minimized, but thermal interface resistance increases and mechanical strength decreases
Solution Approach 1:
The patent introduces a heat spreading lid as an intermediary component between the thin film thermoelectric device and the heat sink. This lid serves as a mediator that distributes thermal energy across a larger area, effectively reducing the thermal interface resistance at the critical bonding interface while allowing the thermoelectric device itself to remain small and thin-film.
Solution Approach 2:
The patent transitions from a purely two-dimensional thermal interface problem to a three-dimensional solution by introducing the heat spreading lid with vertical height. This additional dimension allows thermal energy to spread laterally before reaching the heat sink, effectively increasing the heat transfer area without increasing the footprint of the thermoelectric device.
2Volume of moving object
If thin film thermoelectric devices are used to reduce size, then device dimensions are minimized, but mechanical strength decreases
Solution Approach 1:
The heat spreading lid acts as a protective cushion that absorbs and distributes mechanical stresses before they reach the fragile thin film thermoelectric device. By positioning this rigid structure above the device, the system prepares for mechanical loads in advance, preventing direct transmission of forces that could damage the thin-film structure.
Solution Approach 2:
The heat spreading lid serves as a mechanical intermediary between external loads and the thermoelectric device. It transfers and distributes applied forces across a larger area, reducing the stress concentration on any single point of the fragile thin-film device while still maintaining thermal coupling.
3Temperature
If heat sinks are made large to improve cooling, then heat dissipation improves, but mechanical loading becomes uneven
Solution Approach 1:
The heat spreading lid introduces a vertical dimension to the thermal management system, allowing heat to spread laterally across the lid's surface before reaching the heat sink. This three-dimensional approach enables effective heat dissipation without requiring an excessively large heat sink footprint, thereby maintaining more uniform mechanical loading conditions.
Solution Approach 2:
The heat spreading lid creates local thermal management zones, allowing different regions of the system to operate at optimal temperatures. By distributing heat laterally across the lid surface, the system achieves effective cooling while maintaining consistent thermal and mechanical conditions at the device-hat sink interface.
4Manufacturing precision
If thermal interface material thickness is increased to accommodate height variations, then manufacturing tolerances are relaxed, but thermal interface resistance increases
Solution Approach 1:
The heat spreading lid utilizes the vertical dimension to bridge height variations between thermoelectric devices and the heat sink. By positioning the lid above the devices and allowing it to make contact at multiple points, the system accommodates manufacturing tolerances in the vertical direction without compromising thermal performance at the critical interface.
Solution Approach 2:
The heat spreading lid acts as a mediator that absorbs height variations through its positioning and contact mechanism. It maintains optimal thermal contact with the heat sink while accommodating variations in device heights, thereby preventing the need to increase thermal interface material thickness and the associated increase in thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes thermal interface resistance and enhances mechanical protection for thin film thermoelectric devices, improving cooling efficiency and durability by optimizing the thermal interface and mechanical loading conditions.
Implementation Method 1
a thermal interface material between the thermoelectric devices and the heat spreading lid
Implementation Method 2
a heat spreading lid over the thermoelectric devices
Data Source
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AI summary
Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.