Heat Spreading Lid Structure for High-Power Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages face challenges in thermal management due to limited heat dissipation pathways, particularly with increasing power consumption and power density, which are constrained by the thermal conductivity of interfaces and thermal resistance in interposers and substrates.
Innovation Solution
The implementation of a heat spreading lid, such as a thermoelectric cooler or high-thermal conductivity materials like single-crystal diamond, coupled with semiconductor dies through thermally conductive materials, including liquid metals or gels, to enhance heat transfer and cooling, combined with a cold plate or heat sink for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor packages are used with standard thermal management, then device complexity is low, but thermal management effectiveness is insufficient due to limited heat dissipation pathways
Solution Approach 1:
The thermal management system is segmented into multiple functional layers: heat spreading lid, thermally conductive material layer, cold plate, and heat sink. Each layer performs a specific thermal function, allowing independent optimization of thermal pathways while managing complexity through modular design
Solution Approach 2:
The patent employs composite material structures including heat spreading lid made from high-thermal conductivity materials, thermally conductive materials (such as liquid metals or gels) for thermal coupling, and combination of cold plate with heat sink. These composite structures enhance thermal management effectiveness by leveraging the complementary properties of different materials
2Power
If power consumption and power density are increased, then processing capability improves, but thermal management becomes more difficult due to excessive heat generation
Solution Approach 1:
The patent introduces intermediary thermal management components between the semiconductor die and the external environment: heat spreading lid acts as an intermediary to distribute heat laterally, thermally conductive material serves as intermediary to enhance heat transfer from die to lid, and cold plate with heat sink provides intermediary cooling pathway. These intermediaries enable effective thermal management of high-power devices
Solution Approach 2:
The thermal management approach transitions from one-dimensional vertical heat flow through the substrate to a multi-dimensional heat dissipation system. The heat spreading lid introduces lateral heat spreading in the horizontal plane, creating two-dimensional heat distribution that reduces thermal concentration and improves overall heat dissipation effectiveness for high-power applications
3Loss of energy
If thermal conductivity of interfaces is improved, then heat transfer efficiency increases, but manufacturing complexity increases due to precision requirements for thermally conductive materials
Solution Approach 1:
The patent employs thermally conductive materials with varying properties optimized for specific functions: high-thermal conductivity materials for the heat spreading lid, liquid metals or gels for conformal thermal coupling. The thermally conductive material thickness is controlled within 50-200 micrometers to balance thermal performance and manufacturability, achieving optimal heat transfer without excessive manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves thermal management by actively or passively transferring heat from high-power semiconductor dies to a cold plate, effectively managing high power densities and reducing package footprint.
Implementation Method 1
a thermally conductive material disposed between the one or more semiconductor dies and the heat spreading lid, the thermally conductive material thermally coupling the one or more semiconductor dies and the heat spreading lid
Implementation Method 2
The heat spreading lid comprises a thermoelectric cooler, a metal, a single-crystal diamond, or a combination thereof
Implementation Method 3
The heat spreading lid comprises a thermoelectric cooler
Data Source
AI summary
A semiconductor package includes an interposer having a first principle surface and a second principle surface opposite the first principle surface. One or more semiconductor dies are disposed on the first principle surface of the interposer, and are electrically connected with the second principle surface of the interposer by electrical vias passing through the interposer. A heat spreading lid disposed over the one or more semiconductor dies. A thermally conductive material is disposed between the one or more semiconductor dies and the heat spreading lid. The thermally conductive material thermally couples the one or more semiconductor dies and the heat spreading lid. In some examples, the heat spreading lid may be a thermoelectric cooler. In some examples, the thermally conductive material may be a mixture of a gel and a liquid metal.