Heat Spreading Material for Memory Component Thermal Management

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Solution Overview

Problem

Electronic components, such as memory components, generate heat during operation, leading to varying temperatures among components on a circuit board, which can result in inconsistent performance and potentially damage components if not properly managed.

Innovation Solution

A system incorporating a heat spreading material, such as a thermally anisotropic graphite sheet or copper material, is placed in thermal communication with memory components to efficiently transfer and dissipate heat, ensuring uniform temperatures and preventing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple memory components are operated simultaneously, then productivity increases, but temperature variation among components increases leading to inconsistent performance

Engineering Contradiction:

Improvedata processing throughputVSAvoidtemperature uniformity

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent combines multiple memory components onto a single substrate, allowing them to operate simultaneously and increase productivity. The components share common control logic and data pathways, enabling parallel data processing while maintaining coordinated operation across all components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

A temperature sensing intermediary component is introduced between the memory components and the control logic. This intermediary monitors temperature variations among memory components and provides feedback to the control logic, which then adjusts operating parameters to compensate for temperature differences and maintain consistent performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If memory components operate at high speeds, then productivity increases, but heat generation increases leading to potential component damage

Engineering Contradiction:

Improvedata processing speedVSAvoidheat damage risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent implements a feedback mechanism where temperature sensors continuously monitor the thermal state of memory components during high-speed operation. The control logic receives this temperature feedback and dynamically adjusts operating parameters such as clock frequency or power supply voltage to reduce heat generation when temperature thresholds are approached, thereby preventing component damage while maintaining maximum safe productivity.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system incorporates preliminary thermal management measures by placing temperature sensors in close proximity to memory components before overheating occurs. The control logic is pre-configured with thermal thresholds and compensation algorithms that activate before damage can occur, cushioning against potential heat damage through proactive parameter adjustment.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively manages heat transfer between memory components, maintaining consistent operating temperatures and enhancing performance by reducing temperature differences, thus preventing damage and improving reliability.

Implementation Method 1

a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component. The heat spreading material may be configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat spreading material includes a thermally anisotropic material having higher thermal conductivity within a plane of the heat spreading material than through the plane

Methodology Applied

Scientific EffectThermal anisotropy: Anisotropy

Implementation Method 3

the heat spreading material includes a heat pipe disposed adjacent to the first and second non-volatile memory components

Methodology Applied

Scientific EffectHeat pipe effect: Heat Pipe

Implementation Method 4

a heat sink in thermal communication with the heat spreading material. The heat sink may be configured to dissipate heat from the heat spreading material

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS9530716B2Apparatus, system, and method for transferring heat from memory components

Publication Date: 2016.12.27 PALISADE TECH LLP

AI summary

The apparatus to transfer heat from memory components includes a first non-volatile memory component and a second non-volatile memory component. The apparatus includes a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component. The heat spreading material is configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component.