Heat Spreading Element for Magnetic Sensor Thermal Management
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Solution Overview
Problem
Current sensor devices face challenges in effective heat management, which can impact the performance and reliability of magnetic sensor devices due to inadequate thermal coupling between heating and sensing elements.
Innovation Solution
The implementation of a heat spreading element thermally coupled with a heating element and a sensing element, using an intermediate layer and contact vias to enhance thermal conductivity, while maintaining electrical connectivity, and employing materials like aluminium, polycrystalline silicon, and tungsten for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal coupling between heating element and sensing element is enhanced, then heat management improves, but device complexity increases due to additional heat spreading element and intermediate layer
Solution Approach 1:
A heat spreading element is introduced as an intermediary component between the heating element and the sensing element. This intermediate thermal conduction path enables effective heat management by distributing heat away from the sensing element, while the element can be integrated into the existing device architecture to minimize complexity increases
Solution Approach 2:
The thermal management function is segmented into distinct components: a heating element for generating heat, a heat spreading element for distributing heat, and a sensing element for detection. This segmentation allows each component to be optimized for its specific function while maintaining manageable device complexity through modular design
2Temperature
If heat spreading element is added to distribute heat, then temperature stability improves, but manufacturing complexity increases due to additional fabrication steps
Solution Approach 1:
The heat spreading element is merged with the substrate structure or existing device layers, combining thermal management functionality with the base device architecture. This integration approach enables temperature stability improvement while avoiding separate fabrication processes for the heat spreading component
Solution Approach 2:
The heat spreading element serves multiple functions: it acts as a thermal conduction path for heat management, provides structural support, and can serve as an electrical isolation layer. This multi-functionality reduces the need for additional dedicated components and simplifies manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat management, ensuring stable operation of magnetic sensor devices by effectively distributing heat away from the sensing elements, thereby enhancing their performance and reliability.
Implementation Method 1
A heat spreading element 5, which is thermally coupled with the heating element 3 and the sensing element 11
Implementation Method 2
a heating element 3, which is electrically connectable to a heating current source
Data Source
AI summary
Embodiments discussed herein relate to sensor devices and processes of producing them. Some embodiments include a sensor device with a substrate with a sensing element mounted above the substrate, with a heating element, mounted substantially coplanar to the sensing element; and with a heat spreading element, the heat spreading element thermally coupling the sensing element and the heating element.