Heat-Stabilized Silicone Mixture for Power Module Embedding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current silicone gels used in power modules fail to provide long-term protection and insulation for electronic components at high temperatures due to thermooxidative embrittlement and delamination issues, despite heat stabilization by ferrocene derivatives.
Innovation Solution
A crosslinkable silicone mixture comprising polyorganosiloxane with alkenyl groups, an organosilicon compound with SiH functions, a platinum group catalyst, a ferrocene compound, and an alkoxysilane with an epoxide group, which undergoes cohesive bonding to the substrate, ensuring self-adhesive and heat-stable properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If ferrocene or ferrocene derivatives are added to stabilize silicone gels against heat, then heat stability is improved, but delamination and bubble formation occur at high temperatures
Solution Approach 1:
The patent combines ferrocene-stabilized silicone gel with a specific organosilicon compound containing Si-H groups and a platinum catalyst to create a composite material system. This composite approach allows the ferrocene to provide heat stability while the Si-H groups enable crosslinking that prevents delamination and bubble formation, thus resolving the contradiction between heat stability and protection performance
Solution Approach 2:
The patent modifies the chemical parameters of the silicone gel by introducing Si-H containing organosilicon compounds and platinum catalysts, enabling crosslinking reactions that change the physical and chemical properties of the gel. This parameter change transforms the gel from a simple stabilized material to a crosslinked network structure that maintains both heat stability and adhesion at high temperatures
2Reliability
If silicone gels are used for embedding electronic components, then insulation is provided, but thermooxidative embrittlement occurs above 180°C causing hardening
Solution Approach 1:
The patent converts the harmful thermooxidative embrittlement effect into a beneficial crosslinking process. By adding Si-H containing compounds and platinum catalysts, the oxidation that would normally cause embrittlement is redirected to form crosslinked bonds between polymer chains, transforming the degradation mechanism into a strengthening mechanism that improves both mechanical properties and thermal stability
3Ease of operation
If the modulus of crosslinked silicone is kept low for flexibility, then ease of operation is improved, but delamination and bubble formation occur at high temperatures
Solution Approach 1:
The patent applies local quality by creating different structural characteristics in different regions of the silicone material. The crosslinking density is controlled to provide strong adhesion at the substrate interface while maintaining lower modulus in the bulk material for flexibility. This is achieved through the specific crosslinking reaction of Si-H groups that creates a gradient of mechanical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicone mixture provides long-term protection and maintains insulation performance by preventing delamination and bubble formation, offering sufficient mechanical stability for electronic components at elevated temperatures.
Implementation Method 1
heat-stabilized by addition of ferrocene or ferrocene derivatives, so that the mechanical properties are largely maintained under the action of heat
Implementation Method 2
the alkoxysilane (E) having at least one epoxide group, the silicone mixture can additionally undergo cohesive bonding to the substrate to be protected
Implementation Method 3
a catalyst of the platinum group
Data Source
AI summary
Curable silicone mixture containing an alkenyl-functional silicone, an Si—H functional silicone, an epoxy-functional silicone, a ferrocene, and a hydrosilylation curing catalyst, provide thermally stable silicones which are also adherent. The compositions are particularly useful for embedding power semiconductor devices.