Heat Stamp Surface for Protective Tape Release on Substrates
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Solution Overview
Problem
Current methods for releasing protective tapes from semiconductor substrates during manufacturing are inefficient, particularly in the use of release tapes, which often result in difficulties in forming a looped shape and maintaining adhesion, leading to challenges in effectively detaching the protective tapes without damaging the substrate or the release tapes.
Innovation Solution
A heat stamp with a specifically designed bottom surface featuring protrusions and a unique configuration that allows for the controlled release of the release tape, ensuring consistent adhesion and facilitating the formation of a looped shape, thereby aiding in the efficient detachment of the protective tape from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release tape is used to detach the protective tape from the substrate, then the protective tape can be released, but the release tape often fails to form a looped shape and maintain adhesion properly
Solution Approach 1:
The patent changes the physical parameters of the heat stamp by introducing protrusions with specific dimensions (height of 1-10mm, width of 1-10mm) and spacing (1-10mm) to modify how heat is distributed during the release process, enabling both proper adhesion maintenance and looped shape formation
Solution Approach 2:
The heat stamp acts as an intermediary tool between the release tape and the protective tape. By applying heat through the protrusions, it mediates the release process to ensure the release tape maintains adhesion while forming the necessary looped shape for effective detachment
2Manufacturing precision
If conventional heat stamping is used, then heating is applied to the release tape, but the heat distribution is uneven causing inconsistent release results
Solution Approach 1:
The heat stamp surface is segmented into multiple protrusions rather than a flat surface. This segmentation divides the heating area into discrete zones that can be precisely controlled, ensuring uniform heat distribution across the release tape and consistent release results
Solution Approach 2:
The protrusions create localized heating zones with specific geometric properties (height, width, spacing) that optimize heat transfer to the release tape. Each protrusion provides focused local heating to ensure uniform temperature distribution and consistent release quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat stamp effectively releases the protective tape while maintaining adhesion, preventing acute angle bending of the release tape and ensuring a smooth, efficient process, suitable for manufacturing high-performance semiconductor devices.
Implementation Method 1
a heat stamp used for releasing a protective tape from a substrate
Data Source
AI summary
A heat stamp according an embodiment is the heat stamp used for releasing a protective tape from a substrate, the substrate including a first substrate surface, a second substrate surface provided opposite to the first substrate surface, the protective tape pasted on the second substrate surface, and a release tape having a strip-like configuration, the release tape being pasted on the protective tape from above a fifth end of the second substrate surface to above a sixth end of the second substrate surface, the fifth end and the sixth end facing each other across the center of the second substrate surface, the heat stamp including: a bottom surface having a first side, the first side being provided on a side of a releasing direction of the release tape, the releasing direction being parallel to a longitudinal direction of the strip-like configuration.