Heat Storage Composition with Electronic Phase Transition Particles

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Solution Overview

Problem

Existing heat storage compositions face challenges in efficiently transferring heat from heat-generating components due to the insulating nature of gel or soft rubber materials, and they often experience reduced heat storage performance upon repeated use, as microcapsules can break when mixed with matrix resin materials, and materials undergoing electronic phase transitions may inhibit polymer curing.

Innovation Solution

A heat storage composition comprising a matrix resin, heat storage inorganic particles that undergo electronic phase transitions with latent heat of 1 J/cc or more, and heat conductive particles, which are surface-treated to ensure stability and prevent polymer curing inhibition, forming a sheet for effective heat transfer between heat-generating and dissipating members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If gel or soft rubber is used as the matrix material for heat storage composition, then heat storage capacity is improved, but heat conduction performance deteriorates

Engineering Contradiction:
Improveheat storage capacityVSAvoidheat conduction performance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent uses a composite material system combining gel matrix (for heat storage) with metallic heat conductive particles (for heat conduction). This creates a composite heat storage composition that integrates both heat storage and heat conduction functions, resolving the contradiction between using gel for storage versus its poor conduction properties.

Inventive Principle:
Principle #40Composite materials

2Quantity of substance

If microcapsules containing heat storage material are mixed with matrix resin, then heat storage performance is improved, but microcapsules break and performance degrades upon repeated use

Engineering Contradiction:
Improveheat storage performanceVSAvoidstability upon repeated use
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent replaces fragile microcapsules with a more robust gel matrix system that does not require encapsulation. The heat storage material is directly incorporated into the gel matrix, eliminating the microcapsule structure that is prone to breaking during mixing and repeated use, thereby improving reliability.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Quantity of substance

If heat storage inorganic particles are added to improve heat storage properties, then heat storage capacity increases, but heat conduction performance deteriorates

Engineering Contradiction:
Improveheat storage capacityVSAvoidheat conduction performance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent creates a composite system where heat storage inorganic particles are embedded in a gel matrix, and metallic heat conductive particles are added to the same system. This multi-component composite ensures that heat storage particles provide storage capacity while metallic particles provide conduction pathways, preventing the deterioration of heat conduction performance.

Inventive Principle:
Principle #40Composite materials

4Quantity of substance

If material undergoing electronic phase transition is used for heat storage, then heat storage density is improved, but polymer curing is inhibited

Engineering Contradiction:
Improveheat storage densityVSAvoidpolymer curing
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent separates the heat storage function (performed by inorganic particles undergoing electronic phase transition) from the matrix polymer system. By using inorganic particles rather than organic materials that would interfere with polymerization, the heat storage density is improved while avoiding inhibition of polymer curing.

Inventive Principle:
Principle #2Taking out (Extraction)

5Reliability

If heat conductive filler is added to improve heat conduction, then heat conduction performance is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveheat conduction performanceVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into a single integrated composition: the gel matrix provides heat storage, heat conductive particles provide thermal conduction pathways, and the combination creates a unified heat management material. This merging of functions into one composite material simplifies manufacturing compared to assembling separate heat storage and heat conduction components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves high heat storage and conduction properties, ensuring stable performance even upon repeated use, with improved heat diffusion and uniform dissipation, preventing local heating and enhancing the overall thermal management of electronic components.

Implementation Method 1

heat storage inorganic particles which are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition

Methodology Applied
Scientific EffectElectronic phase transition:

Implementation Method 2

heat conductive particles... The heat conductivity of the heat storage composition is 0.3 W/m·K or more

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3020779B1Heat-storage composition
Publication Date: 2018.06.20 FUJI POLYMER INDUSTRIES CO LTD
  • EP3020779B1 patent drawingFigure 1
  • EP3020779B1 patent drawingFigure 2A~2B
  • EP3020779B1 patent drawingFigure 3~4

AI summary

A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.