Heat Storage Section for Portable Electronic Enclosure Thermal Management
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Solution Overview
Problem
Electronic apparatuses face challenges in efficiently dissipating heat generated by components, particularly in portable devices where space is limited, leading to potential temperature increases that can affect operation stability and lifespan.
Innovation Solution
Incorporating a heat storage section that detects and manages heat storage amounts, allowing for controlled operation of heating components to mitigate temperature rises within the enclosure, using a power reception device with a substrate, contact member, and electronic circuit configuration that includes a heat storage section to efficiently manage heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the surface area of the enclosure is increased to dissipate heat more efficiently, then heat dissipation performance is improved, but the size of portable electronic apparatus is increased
Solution Approach 1:
The heat dissipation function is segmented into multiple heat dissipation sections (first heat dissipation section and second heat dissipation section) that are distributed across different surfaces of the enclosure. This allows efficient heat dissipation across the available surface area without increasing the overall enclosure volume, as each section independently contributes to heat rejection.
Solution Approach 2:
Heat dissipation is extended from a single surface to multiple surfaces of the enclosure by adding heat dissipation sections on different faces. This multi-dimensional approach increases the effective heat dissipation area without proportionally increasing the enclosure volume, as the heat dissipation occurs across the existing three-dimensional structure.
2Temperature
If more heat dissipation structures are added to the enclosure, then heat dissipation efficiency is improved, but device complexity is increased
Solution Approach 1:
The enclosure serves multiple functions: it provides structural support, contains electronic components, and acts as a heat dissipation structure through the integrated heat dissipation sections. By making the enclosure itself the heat dissipation structure rather than adding separate external heat sinks, the design achieves efficient heat dissipation without increasing overall structural complexity.
Solution Approach 2:
The heat dissipation sections are merged with the enclosure structure itself rather than being separate attached components. The first and second heat dissipation sections are formed as integral parts of the enclosure, combining the housing function with the heat dissipation function into a single unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses temperature increases inside the enclosure by monitoring and managing heat storage, enhancing the operational stability and lifespan of electronic components in portable devices.
Implementation Method 1
a heat storage section configured to store therein at least a part of heat generated from a heating section
Data Source
AI summary
There is provided an electronic apparatus including: a heating section; a heat storage section; a detection section configured to detect a heat storage amount of the heat storage section; and a control section configured to control operation of the heating section, based on the heat storage amount detected by the detection section.