Multi-Layer Heat Structure for 5G Thermal and RF Management
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Solution Overview
Problem
5G wireless devices experience excessive heat generation, leading to thermal overload and reduced RF efficiency due to conventional heat mitigation techniques that introduce RF diffraction and copper (I2R) loss, necessitating a solution that effectively manages heat while maintaining RF performance.
Innovation Solution
A multi-layered heat structure comprising a thermally conductive layer surrounded by electrically conductive material, with electrically conductive vias to short circuit and minimize RF signal absorption, optimizing heat spreading and dissipation while maintaining RF efficiency by creating a high-impedance surface that reflects RF signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat spreaders or heat sinks are used to channel and distribute heat, then heat dissipation is improved, but RF efficiency deteriorates due to RF diffraction and copper (I2R) loss
Solution Approach 1:
The heat structure is segmented into multiple functional layers: a thermally conductive core layer for heat dissipation, surrounded by electrically conductive layers with specific thickness (at least skin depth) to reflect RF signals, and electrically conductive vias to short circuit the conductive layers. This segmentation allows each layer to perform its specialized function without interfering with the other, resolving the contradiction between heat dissipation and RF efficiency.
Solution Approach 2:
The patent employs a composite structure combining materials with different properties: the thermally conductive layer (e.g., aluminum nitride, aluminum oxide, beryllium oxide) provides heat dissipation, while the surrounding electrically conductive layers (e.g., copper, aluminum) provide RF signal reflection. This composite material approach enables simultaneous optimization of thermal management and RF performance.
2Productivity
If higher data rates and faster communication performance are implemented in 5G devices, then productivity is improved, but heat generation increases causing thermal overload
Solution Approach 1:
The heat structure acts as an intermediary component positioned between the heat-generating antenna module and the device housing. It provides a dedicated thermal management pathway that allows high-data-rate operation to continue without thermal overload, mediating between the conflicting requirements of high productivity and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat and enhances RF performance by reducing signal loss and absorption, preventing thermal shutdown and maintaining device performance in high-temperature conditions.
Implementation Method 1
a thermally conductive layer formed from a first material
Implementation Method 2
a first electrically conductive layer formed from a second material and adhered to a first surface of the thermally conductive layer, the first electrically conductive layer having a thickness corresponding at least to a skin depth of the second material
Data Source
AI summary
Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.