Heat-Dissipating Substrate Structure for Thick Electrode Insulation
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Solution Overview
Problem
Conventional methods for creating heat dissipating substrates for high-power semiconductor elements face challenges in maintaining profitability and insulating strength due to limitations in etching and plating processes, which also result in environmental pollution.
Innovation Solution
A heat dissipating substrate with a thick electrode metal plate and a preparation method that uses a pattern space formed by isotropic etching, dove tail-shaped grooves, and reinforcement protrusions, along with an insulating layer and a metal base, to enhance thermal conductivity and insulating strength while avoiding toxic chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of electrode metal plate is increased to mount high-power semiconductor, then heat dissipating performance is improved, but etching or plating method cannot be applied and manufacturing profitability deteriorates
Solution Approach 1:
The patent replaces the chemical etching or plating process with a mechanical cutting process to form circuit patterns on thick electrode metal plates (0.3mm or more). This mechanical substitution enables the use of thick metal plates for high-power semiconductor mounting while maintaining manufacturing profitability, as mechanical cutting is economically feasible for thick materials whereas etching/plating becomes unprofitable beyond certain thicknesses.
2Temperature
If the thickness of electrode metal plate is increased to mount high-power semiconductor, then heat dissipating performance is improved, but cross-sectional profile of electrode pattern is degraded and dielectric breakdown risk increases
Solution Approach 1:
The patent applies different processing methods to different regions of the electrode metal plate. The circuit pattern areas are mechanically cut to achieve precise cross-sectional profiles with vertical walls, while the non-circuit areas maintain the original thick plate structure. This local differentiation ensures good dielectric breakdown resistance in patterned areas while preserving overall heat dissipating performance through the thick plate structure.
3Ease of manufacture
If etching or plating process is used to form circuit pattern, then circuit electrode pattern can be formed, but toxic chemicals or heavy metals are used causing environmental pollution
Solution Approach 1:
The patent replaces chemical etching or plating processes with mechanical cutting methods (such as laser cutting, water jet cutting, or mechanical blade cutting) to form circuit patterns on the electrode metal plate. This substitution eliminates the use of toxic chemicals and heavy metals associated with traditional etching and plating processes, thereby preventing environmental pollution while still achieving precise circuit pattern formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a heat dissipating substrate with improved thermal performance, insulating strength, and high peel strength, while being eco-friendly by replacing toxic etching and plating processes with mechanical methods.
Implementation Method 1
a metal base configured to constitute a heat dissipating body that diffuses and dissipates heat discharged from the semiconductor element through thermal conduction
Data Source
AI summary
Provided are a heat dissipating substrate and a preparation method thereof, which can form a precise pattern in a thick electrode metal plate and improve insulating strength and peel strength. heat dissipating substrate for semiconductor may include: an electrode metal plate having a plurality of electrode patterns which are electrically insulated from each other by a pattern space formed therebetween; a metal base disposed under the electrode metal plate, and configured to diffuse heat conducted from the electrode metal plate; an insulating layer formed between the electrode metal plate and the metal base; and an insulating material filled portion configured to fill the pattern space and a peripheral portion outside an electrode pattern group composed of the plurality of electrode patterns, and support the electrode patterns while brought in direct contact with side surfaces of the plurality of electrode patterns.