Heat Dissipation Substrate Stacking for Warpage-Resistant Power Modules
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Solution Overview
Problem
Existing heat dissipation substrates for power semiconductor modules face challenges in meeting strict thickness specifications due to varying ceramic substrate and metal plate thicknesses, leading to warpage, reduced bonding strength, and increased porosity, especially in ultra-high temperature environments.
Innovation Solution
A method of manufacturing heat dissipation substrates involves preparing insulating substrates and metal plates with unique thickness ratios, marking unique codes for identification, and using an automatic alignment stacking system to ensure precise alignment and bonding, thereby controlling the thickness ratios and improving bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If ceramic substrates and metal plates with varying thicknesses are used in heat dissipation substrates, then material selection flexibility is improved, but manufacturing precision deteriorates due to inability to meet strict thickness specifications
Solution Approach 1:
The patent applies preliminary action by pre-classifying ceramic substrates into groups based on their thickness measurements before assembly. Thickness measurement and classification are performed in advance, allowing subsequent selective combination of substrates and metal plates to achieve target thickness specifications. This preliminary classification enables precise thickness control despite variations in individual component thicknesses.
Solution Approach 2:
The patent changes the parameter of thickness by selectively combining ceramic substrates of different thicknesses with metal plates of varying thicknesses. By adjusting the combination of components based on their measured thickness parameters, the final heat dissipation substrate achieves precise thickness control. The system transforms fixed thickness components into a flexible parameter system where the final thickness is determined by the specific combination selected.
2Ease of manufacture
If components with different thermal expansion coefficients are assembled without thickness control, then assembly ease is improved, but reliability deteriorates due to warpage in ultra-high temperature environments
Solution Approach 1:
The patent performs preliminary thickness measurement and classification of ceramic substrates before assembly. By knowing the exact thickness of each substrate in advance, the system can pre-calculate the required metal plate thickness to achieve the target overall thickness. This preliminary action ensures that thermal expansion compatibility is addressed before assembly, preventing warpage while maintaining assembly ease through a systematic approach.
Solution Approach 2:
The patent applies local quality by adjusting the thickness of specific components (ceramic substrates and metal plates) based on their individual characteristics. Rather than requiring all components to have uniform thickness, the system allows local variations in thickness while maintaining overall dimensional accuracy. This enables easy assembly of diverse components while ensuring reliable thermal expansion matching in the final assembled product.
3Device complexity
If thickness specifications are not strictly controlled, then manufacturing complexity is reduced, but bonding strength deteriorates due to increased porosity
Solution Approach 1:
The patent measures and classifies ceramic substrate thicknesses before assembly, performing the critical thickness control action in advance. This preliminary measurement and classification simplifies the manufacturing process by organizing components into ready-to-assemble groups, reducing on-site complexity. Meanwhile, it ensures bonding strength by guaranteeing that only properly thickened substrate-metal plate combinations are assembled, minimizing porosity and maximizing bonding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents warpage, ensures high-density power semiconductor module implementation, and improves bonding strength by controlling the thickness ratios and using precise alignment techniques, while also enabling accurate management of production and quality information.
Implementation Method 1
performing a hot press process on the stacked first metal plate, the insulating substrate, and the second metal plate
Data Source
Figure 1a~1b
Figure 2A~2B
Figure 2C
AI summary
The embodiment relates to a ceramic substrate for a heat dissipation substrate, a heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same, a power converter including the same, and a method of manufacturing the same. The method of manufacturing a heat dissipation substrate for a power semiconductor module includes preparing an insulating substrate, preparing first and second metal plates, stacking the first metal plates, stacking the insulating substrate on the first metal plate, stacking a second metal plate on the insulating substrate and performing a hot press process on the stacked first metal plate, the insulating substrate, and the second metal plate. The first thickness of the first metal plate is different from a second thickness of the second metal plate.