Heat transfer apparatus for a computer environment

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Solution Overview

Problem

Legacy cooling systems for computer environments struggle to dissipate the increased heat generated by advanced computer processors and memory devices, leading to component failures and reduced performance due to excess heat.

Innovation Solution

The implementation of a heat transfer apparatus that includes a thermally-conductive body, a cold plate thermally coupled to a liquid coolant system, and a thermoelectric cooler (TEC) to enhance heat transfer from components to a liquid coolant, allowing for increased heat capture and reduced cooling of ambient air, thereby improving heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If legacy cooling systems are used, then the system structure is simple, but the heat dissipation capability is insufficient leading to component failures

Engineering Contradiction:

Improvecomponent reliabilityVSAvoidcooling system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple heat conduction blocks into a single integrated heat transfer apparatus that couples components to the liquid coolant system, reducing structural complexity while maintaining or improving heat dissipation capability and component reliability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a thermoelectric cooler as an intermediary device between the heat source and liquid coolant system, enabling more effective heat transfer and improving component reliability without significantly increasing overall system complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

2Power

If processor power increases, then computational performance improves, but heat generation increases beyond legacy cooling capacity

Engineering Contradiction:

Improveprocessor powerVSAvoidcomponent temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent employs a liquid coolant system with cold plates and heat transfer apparatus to replace air-based cooling, utilizing fluid dynamics to efficiently remove heat from high-power processors and prevent excessive temperature rise

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent replaces traditional passive mechanical cooling structures with an active thermoelectric cooler system that uses electrical energy to drive heat transfer, enabling effective cooling of high-power processors that generate excessive heat for conventional systems

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If multiple heat conduction blocks are used, then heat transfer coverage increases, but device complexity and space requirements increase

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidnumber of heat conduction blocks

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple heat conduction blocks into a single integrated heat transfer apparatus that directly couples components to the liquid coolant system, reducing the number of separate parts while maintaining effective heat transfer coverage and simplifying the overall structure

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent designs the heat transfer apparatus to serve multiple cooling functions simultaneously, with the liquid coolant system and cold plates providing thermal management for various components through a unified structure, eliminating the need for separate heat conduction blocks

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution increases the heat capture ratio of the liquid coolant system, reduces the need for multiple heat conduction blocks, and provides adaptable cooling solutions for various environments, enhancing the reliability and performance of computer systems by effectively managing heat dissipation.

Implementation Method 1

a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC

Methodology Applied

Scientific EffectPeltier Effect: Peltier Effect

Implementation Method 2

a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS11249522B2Heat transfer apparatus for a computer environment

Publication Date: 2022.02.15 INTEL CORP

AI summary

Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.