Heat Transfer Assembly with Movable Device and Conduction Card
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Solution Overview
Problem
Existing heat transfer systems between conduction cards and heat sinks are mechanically limited, costly, and inefficient, with limited surface area contact, restricting effective heat dissipation.
Innovation Solution
A heat transfer assembly featuring a movable heat transfer device that contacts at least three surfaces of a heat sink with non-perpendicular angles, allowing for increased surface area contact and efficient heat transfer through a combination of the conduction card and movable heat transfer device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wedge lock clamping mechanism is used to thermally link the conduction card to the chassis, then the conduction card is mechanically secured, but the mechanical joint becomes a major thermal bottleneck limiting heat transfer efficiency
Solution Approach 1:
The heat transfer path is segmented into multiple independent contact surfaces (first surface, second surface, third surface) instead of relying on a single mechanical joint. This segmentation allows heat to dissipate through multiple parallel pathways, reducing the bottleneck effect of any single contact point while maintaining mechanical security through the distributed clamping arrangement.
Solution Approach 2:
The invention transitions from a single-point or single-surface thermal contact to a multi-surface three-dimensional thermal interface. By engaging the heat sink across multiple surfaces (front, top, and side surfaces of the conduction card), the thermal contact area is expanded into three-dimensional space, dramatically improving heat transfer efficiency while the wedge lock mechanism maintains mechanical security.
2Loss of energy
If heat pipes or thermally conductive materials are used to increase surface area contact, then heat transfer capability is improved, but mechanical limitations and cost-effectiveness are reduced
Solution Approach 1:
The heat sink is designed to perform multiple functions simultaneously: it provides mechanical support, thermal dissipation, and structural alignment. By making the heat sink itself the primary heat transfer medium across multiple surfaces rather than adding separate heat pipes or conductive materials, the system achieves enhanced heat transfer capability without increasing mechanical complexity or compromising cost-effectiveness.
Solution Approach 2:
The invention merges the mechanical support function and thermal dissipation function into a single integrated heat sink structure. Instead of using separate components like heat pipes or conductive materials to bridge the conduction card and chassis, the heat sink directly contacts multiple surfaces of the conduction card, combining structural and thermal functions in one element, thereby reducing device complexity while improving heat transfer.
3Area of stationary object
If a spiral lock is used to exert omni-directional force for heat transfer, then a conduction card can contact one surface while the spiral lock contacts two other surfaces, but the system becomes complicated, expensive, and does not involve direct contact between condenser and heat sink
Solution Approach 1:
Instead of using a complex spiral lock mechanism to force contact between components, the invention inverts the approach by designing the conduction card and heat sink with complementary non-perpendicular angles that naturally guide and maintain multi-surface contact. The geometry itself creates the omni-directional force distribution, eliminating the need for a spiral lock while achieving the same heat transfer surface area expansion.
Solution Approach 2:
The invention employs asymmetric non-perpendicular angles on the conduction card and heat sink surfaces rather than symmetric perpendicular contacts. This asymmetric geometry allows the components to engage across multiple surfaces (front, top, and side) in a natural fit, expanding heat transfer area without requiring the complex spiral lock mechanism. The asymmetric design simplifies the overall system by using geometric form rather than mechanical force mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency, reduces mechanical limitations, decreases costs, and extends the operational life of heat transfer systems by increasing the number of surfaces in contact and allowing direct contact between the heat sink and heat transfer components.
Implementation Method 1
heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink... transferring heat through at least three surfaces of the heat sink
Data Source
AI summary
A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.