Heat Transfer Block Structure for High-Voltage Box Cooling
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Solution Overview
Problem
Inefficient heat dissipation in high-voltage distribution boxes of new energy vehicles leads to increased temperatures, impairing the service life of components and posing safety hazards.
Innovation Solution
A heat dissipation structure with a heat transfer block connected to a heat source through a connecting portion, allowing efficient heat conduction and distribution, including a housing, heat source, and heat transfer block with close-fitting surfaces and connecting pieces for stable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation methods are used in high-voltage distribution boxes, then the structure is simple, but the heat dissipation efficiency is low and temperatures rise
Solution Approach 1:
A heat transfer block is introduced as an intermediary component between the heat source and the external environment. The heat transfer block includes a heat transfer surface that is in close fit with the heat dissipation surface of the heat source, and at least one surface exposed outside the housing, serving as a thermal conduit to transfer heat from the enclosed heat source to the external environment for dissipation.
Solution Approach 2:
The heat transfer block extracts heat from the heat source and removes it from the accommodation cavity. By having at least one surface exposed outside the housing, the heat is taken out of the enclosed space and transferred to the external environment, effectively removing the thermal energy from the system's critical region.
2Loss of energy
If a heat transfer block with close-fitting surfaces is used, then heat dissipation efficiency increases, but the device complexity increases
Solution Approach 1:
The heat transfer block merges multiple functions into a single component: it serves as both a thermal transfer medium and a structural element that can be integrated into the housing. The block combines the heat transfer surface for thermal contact with the heat source and external surfaces for heat dissipation, consolidating thermal management functionality into one piece rather than multiple separate components.
3Loss of energy
If the first heat transfer surface keeps in close fit with the heat dissipation surface, then heat conduction efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The close fit between the heat transfer surface and heat dissipation surface is implemented locally at the critical thermal interface, rather than requiring precise fit throughout the entire component. This localized precision approach focuses manufacturing tolerances only where thermal contact is essential, reducing overall manufacturing complexity while maintaining effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capacity and efficiency, reducing temperatures in the high-voltage distribution box and nearby regions, thereby improving component lifespan and safety.
Implementation Method 1
heat of the heat source is conducted to the heat transfer block, and the heat transfer block can further conduct the heat out of the accommodation cavity
Data Source
AI summary
A heat dissipation structure includes a housing configured to form an accommodation cavity and a heat source disposed in the accommodation cavity. The heat source includes a heat dissipation surface, and the heat source includes a first connecting portion. The heat dissipation structure further includes a heat transfer block inserted in the housing and including at least one surface exposed outside the housing, a first heat transfer surface, and a second connecting portion. The first connecting portion is connected to the second connecting portion directly or through a connecting piece so that the first heat transfer surface keeps in close fit with the heat dissipation surface.