Heat Transfer Clamp Assembly for Tolerance-Tolerant Electronics Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current heat transfer systems for electronic devices face challenges in efficiently managing thermal dissipation, particularly in high-density applications where tight tolerances and thermal interface material degradation lead to temperature drops and limitations in size, weight, and power considerations, especially under thermal cycling and through-plane conductivity constraints.
Innovation Solution
A heat transfer assembly comprising a flexible, heat conductive layer with a compressible matrix and phase change material, thermally coupled between a heat transfer rail and a housing, providing a multi-path heat transport mechanism with adjustable mechanical retention and damping, using alignment features like fasteners or magnetic bodies to secure the circuit board within the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If tight tolerances are used to reduce space between component and heat sink, then heat transfer efficiency is improved, but manufacturing complexity and cost increase due to controlled component tolerances
Solution Approach 1:
The patent changes the bonding parameter from rigid fixed tolerances to flexible variable bonding, allowing the bond line thickness to vary between 0.002 inches and 0.010 inches while maintaining effective heat transfer through the flexible heat conductive layer
Solution Approach 2:
The patent uses a flexible heat conductive layer (thin film) that can conform to tolerance variations and maintain thermal contact without requiring precise manufacturing tolerances, thus resolving the contradiction between heat transfer efficiency and manufacturing precision
2Temperature
If composite structures with heat pipes are used to spread heat, then heat conduction is improved, but device complexity increases due to multiple components and assembly steps
Solution Approach 1:
The patent merges the heat conduction function and the flexible bonding function into a single integrated flexible heat conductive layer, eliminating the need for separate heat pipes, spreader plates, and multiple assembly steps while maintaining effective heat conduction
3Ease of manufacture
If thermal interface material bond lines are made thicker to accommodate tolerance, then ease of assembly is improved, but temperature drop increases from 5°C to 15°C
Solution Approach 1:
The patent changes the thermal interface parameter by introducing a flexible heat conductive layer with superior thermal conductivity compared to traditional TIMs, allowing thicker bond lines (0.002-0.010 inches) to be used without incurring the 5°C to 15°C temperature drops associated with conventional materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal resistance by up to 79% compared to traditional methods, enhances mechanical retention, and adapts to disparate thermal expansion rates, improving heat dissipation efficiency and reliability in constrained environments.
Implementation Method 1
a flexible, heat conductive layer comprising a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing
Implementation Method 2
a phase change material may be within the compressible matrix
Implementation Method 3
a compressible layer thereon may be between the first and second portions of the flexible, heat conductive layer. The compressible layer may comprise a compressible matrix
Data Source
AI summary
An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.