Heat Transfer Device for Electric Machine Thermal Management
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Solution Overview
Problem
High-power rotary electric machines face challenges in efficiently dissipating heat generated by electronic components, particularly in sealed types, due to low internal resistance and miniaturization of components, leading to potential overheating and reduced efficiency.
Innovation Solution
A rotary electric machine design featuring a heat transfer device with a base portion connected to the electronic component and an upper portion extending to the heat sink, utilizing a thermally conductive material and a flap to effectively transfer heat away from the component, preventing short circuits and optimizing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electronic components are miniaturized and internal resistance is reduced to increase power output, then power output and efficiency are improved, but heat dissipation becomes insufficient leading to overheating
Solution Approach 1:
The heat transfer device extends in the vertical dimension from the printed circuit board upward toward the heat sink, creating a three-dimensional heat conduction path. This dimensional extension allows heat to be extracted from the miniaturized components without increasing the planar footprint, resolving the contradiction between compact component size and adequate heat dissipation surface area
Solution Approach 2:
The heat transfer device acts as an intermediary element between the electronic component and the heat sink. It provides a dedicated thermal conduction path that bridges the gap between the miniaturized component (with limited heat dissipation capability) and the heat sink (with high heat dissipation capability), enabling effective heat removal despite the component's small size and low internal resistance
2Loss of energy
If heat transfer device is placed in contact with the heat sink, then heat dissipation efficiency is improved, but electrical short circuits may occur
Solution Approach 1:
The electrically insulating paste serves as an intermediary substance between the heat transfer device and the heat sink. It provides thermal conduction while blocking electrical current, allowing the heat transfer device to contact the heat sink for efficient heat dissipation without creating an electrical short circuit path
Solution Approach 2:
The paste material exhibits different conductive properties for heat versus electricity - it is thermally conductive to enable heat transfer but electrically insulating to prevent short circuits. This parameter differentiation allows simultaneous achievement of high heat dissipation efficiency and electrical isolation, resolving the contradiction between thermal performance and electrical safety
3Volume of moving object
If the tab of electronic component is thinned for miniaturization, then component size is reduced, but heat transfer capability deteriorates
Solution Approach 1:
Instead of relying on the thinned tab's planar area for heat transfer, the heat transfer device extends vertically upward to create additional heat conduction pathways in the third dimension. This compensates for the reduced cross-sectional area of the thinned tab by providing multiple parallel thermal conduction routes through the extended structure
Solution Approach 2:
The heat transfer device is divided into distinct portions: a base portion that contacts the thinned tab and collects heat, and an upper portion that extends toward the heat sink. This segmentation allows the device to adapt to the miniaturized component geometry while maintaining effective heat transfer capability through the extended structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency, reducing thermal resistance and preventing overheating, thereby improving the reliability and performance of the electronic module in high-power applications.
Implementation Method 1
the heat transfer device, placed in contact with the cap 3, by a thermally conductive and electrically insulating paste 24, transfers the heat to the cap 3
Implementation Method 2
a heat sink for dissipating the heat generated by the electronic module
Data Source
AI summary
A rotary electric machine includes an electronic module and a heat sink for dissipating heat produced by the module. The module includes a printed circuit, an electronic component having a base positioned on the printed circuit, a heat transfer device connected to the printed circuit and to the electronic component for transferring heat generated by the component to the heat sink. The heat transfer device includes an upper portion extending from the printed circuit towards the heat sink from the same side of the component and a base portion connected to the upper portion and positioned in the printed circuit at least partly under the component to form, at least partly, a preferential path for the heat, from the base of the electronic component to the heat sink. The electronic component is connected at least partly by its own base to the base portion of the heat transfer device.