Integrated Heat Transfer Element with Phase Change Material

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Solution Overview

Problem

There is a continuing need for improved heat transfer elements for integrated device packages to efficiently manage heat generated by electrical components.

Innovation Solution

A bonded structure is developed, comprising a housing with a chamber containing a phase change material and a metal bonding structure that bonds the heat transfer element to an electrical component, allowing for direct thermal communication and efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a phase change material is used for heat transfer, then heat dissipation efficiency is improved, but the bonding strength between the heat transfer element and the electrical component may be insufficient

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidbonding strength

Core Design Contradiction:

Loss of energyVSStrength

Solution Approach 1:

The heat transfer element is segmented into distinct functional regions: a phase change material region for heat dissipation and a metal bonding structure region for mechanical attachment. This segmentation allows each region to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention merges two previously separate components (heat transfer element and bonding structure) into a single integrated heat transfer element. The metal bonding structure is formed as an integral part of the heat transfer element, combining heat dissipation and bonding functions in one component.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If a metal bonding structure is added to improve bonding strength, then attachment reliability is improved, but device complexity increases

Engineering Contradiction:

Improveattachment reliabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The bonding structure is merged with the heat transfer element to form a single integrated component. This eliminates the need for separate bonding operations and reduces the total number of parts, thereby reducing device complexity while maintaining reliable attachment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat transfer element serves multiple functions: it acts as both the heat dissipation component (via phase change material) and the bonding component (via metal bonding structure). This multi-functionality reduces the overall device complexity by eliminating redundant components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of energy

If the phase change material is in direct contact with the metal bonding structure, then heat transfer efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcontact interface precision

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The heat transfer element exhibits local quality differentiation: the phase change material region provides thermal contact, while the metal bonding structure region provides mechanical attachment. This local differentiation allows each region to be optimized for its specific function, with the bonding structure providing a robust interface that is less sensitive to manufacturing tolerances.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a high-efficiency thermal dissipation pathway, maintaining the electrical component within a desired temperature range by leveraging the phase change material and reactive metal bonding structure.

Implementation Method 1

The phase change material is configured to change phase between a liquid phase and a vapor phase, or between a solid phase and a liquid phase

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

The phase change material is disposed in the chamber. The phase change material is in thermal communication with a first side of the metal bonding structure

Methodology Applied

Scientific EffectLatent heat: Latent Heat

Implementation Method 3

The phase change material is in thermal communication with a first side of the metal bonding structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12241689B2Heat transfer element

Publication Date: 2025.03.04 ANALOG DEVICES INC

AI summary

A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.