Heat-Transfer Liquid Solution for Immersion Cooling
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Solution Overview
Problem
Current heat-transfer liquids for liquid immersion cooling systems in data centers face challenges in maintaining dielectric properties and preventing contamination, which can lead to electrical and chemical property degradation, causing errors and malfunctions in electronic data storage devices.
Innovation Solution
A heat-transfer liquid solution is formulated by combining a solvent component with a solute component, where the solute is chosen to inhibit mass transfer of materials from electronic devices and equipment, maintaining the dielectric and chemical properties of the solvent, and ensuring the solution remains a single-phase at operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-transfer liquid is used for liquid immersion cooling, then heat transfer efficiency is improved, but dielectric properties deteriorate due to contamination and mass transfer of materials from electronic devices
Solution Approach 1:
The patent applies preliminary action by pre-formulating the heat-transfer liquid with specific solutes (fluorinated compounds, esters, ethers, or hydrocarbons) that will inhibit mass transfer of materials from electronic devices before contamination occurs. This preventive formulation ensures the liquid maintains its dielectric properties while still providing effective heat transfer cooling
Solution Approach 2:
The patent changes the chemical composition parameters of the heat-transfer liquid by specifying precise compositional ranges (e.g., first solvent 5-40%, second solvent 30-60%, third solvent 5-40%) and selecting compounds with specific molecular structures that balance thermal conductivity with dielectric stability, thereby resolving the contradiction between heat transfer efficiency and dielectric property maintenance
2Temperature
If heat-transfer liquid is used for liquid immersion cooling, then cooling performance is improved, but chemical properties deteriorate due to contamination
Solution Approach 1:
The patent converts the potential harm of liquid-contaminant interaction into a benefit by selecting solutes that actively inhibit mass transfer of materials from electronic devices. The formulated liquid uses specific chemical compounds (fluorinated compounds, esters, ethers, hydrocarbons) that resist absorbing or reacting with materials from electronic components, thereby maintaining chemical stability while providing superior cooling performance
3Ease of manufacture
If conventional heat-transfer liquid formulation is used, then manufacturing simplicity is maintained, but contamination prevention capability is insufficient
Solution Approach 1:
The patent applies composite materials by formulating the heat-transfer liquid as a multi-component mixture (first solvent, second solvent, third solvent, and optional fourth solvent) where each component contributes specific properties. This composite formulation enhances contamination prevention capability through synergistic effects while maintaining practical manufacturability through straightforward mixing processes and available commercial-grade ingredients
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents contamination and maintains the integrity of the heat-transfer liquid, reducing failure rates and ensuring reliable operation of electronic data storage devices by maintaining the dielectric and chemical properties of the solvent.
Implementation Method 1
the solute is chosen to inhibit mass transfer of materials from electronic devices and equipment
Implementation Method 2
maintaining the dielectric and chemical properties of the solvent
Data Source
AI summary
The present disclosure includes methods of making a heat-transfer liquid solution by combining a heat-transfer liquid with a solute component to form a heat-transfer liquid solution, and related heat-transfer liquid solutions and methods of using.


