Heat Transfer Assembly with Spring-Loaded Thermal Pad
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Solution Overview
Problem
Existing heat transfer assemblies in electronic devices face challenges in efficiently transferring heat from multiple heat sources, especially in slim box designs or space-limited environments, and often suffer from electromagnetic interference (EMI) issues due to shielding requirements.
Innovation Solution
A heat transfer assembly comprising a heat plate, a thermal conductive sheet, a thermal pad, and a spring, where the spring compresses to enhance thermal contact between the thermal pad and the heat source, and an RF shield is used to reduce EMI, facilitating efficient heat transfer through a combination of thermal conduction, convection, and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat transfer assembly is configured to contact heat sources firmly for efficient heat transfer, then heat transfer efficiency is improved, but the device complexity increases due to the need for springs or flexible members to bridge gaps
Solution Approach 1:
The heat transfer assembly is segmented into multiple functional layers: a rigid heat plate for structural support and primary heat conduction, flexible thermal pads for conformal contact with heat sources, and thermal conductive sheets for heat distribution. This segmentation allows each component to perform its specific function optimally while working together as an integrated system.
Solution Approach 2:
The assembly uses composite material structures combining rigid materials (heat plate) with flexible materials (thermal pads) and conductive materials (thermal sheets). This composite approach enables the system to achieve both firm contact for efficient heat transfer and structural stability without requiring complex spring mechanisms.
2Object-affected harmful factors
If shielding is added to reduce EMI in space-limited devices, then EMI protection is improved, but the device volume increases
Solution Approach 1:
The shielding function is merged with the existing heat transfer assembly structure. The heat plate and thermal components are designed to also serve as EMI shielding elements, eliminating the need for separate shielding components and avoiding additional volume in space-limited devices.
Solution Approach 2:
The heat transfer components are designed with multi-functionality, serving both thermal management and EMI shielding purposes. This universal design allows a single component to perform multiple functions, reducing the overall device volume by eliminating redundant elements.
3Adaptability or versatility
If multiple heat sources are present in a slim box design, then device functionality is improved, but heat transfer efficiency deteriorates due to limited space for heat dissipation
Solution Approach 1:
The heat transfer assembly utilizes vertical layering and three-dimensional heat distribution pathways. The heat plate and thermal sheets create multiple heat conduction paths in different directions, allowing efficient heat dissipation from multiple sources within the constrained horizontal space of a slim box design.
Solution Approach 2:
The thermal management components are nested within the device structure, with thermal pads positioned between heat sources and the heat plate, and thermal sheets layered above. This nested arrangement maximizes heat transfer efficiency within the limited vertical space available in slim box designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly effectively transfers heat from multiple heat sources to an external environment while minimizing EMI interference, improving thermal control and reducing the risk of overheating in electronic devices.
Implementation Method 1
the spring compresses to enhance thermal contact between the thermal pad and the heat source
Implementation Method 2
thermal conduction, convection, and radiation
Implementation Method 3
thermal conduction, convection, and radiation
Implementation Method 4
thermal conduction, convection, and radiation
Implementation Method 5
an RF shield is used to reduce EMI
Data Source
AI summary
A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.