Heat-transferring and electrically connecting device and electronic device
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Solution Overview
Problem
Existing heat evacuation solutions for electronic components, such as metal heat-transferring members with radiators, are ineffective in small volumes or when components are remotely located, as they fail to efficiently manage heat transfer between heat sources and sinks.
Innovation Solution
A heat-transferring device comprising a stack of alternating heat-conducting and heat-absorbing layers, where the heat-conducting layers are made of materials like metal or graphite and the heat-absorbing layers contain phase-change materials, allowing for efficient heat transfer and management through conduction and phase-change processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal heat-transferring members with radiators are used, then heat transfer capability is improved, but device volume increases and adaptability to remote components deteriorates
Solution Approach 1:
The patent utilizes phase-change materials (such as paraffin or other materials that transition from solid to liquid) within the heat-absorbing layers to absorb and store thermal energy. When the phase-change material melts, it absorbs large amounts of latent heat, effectively managing temperature peaks without requiring large radiator structures. This resolves the contradiction by providing efficient heat transfer capability while maintaining a compact form factor suitable for small-volume devices and remote component placement.
Solution Approach 2:
The invention employs a composite layered structure combining heat-conducting materials (such as aluminum or copper sheets) with heat-absorbing materials (phase-change materials enclosed in flexible jackets). This composite construction integrates both high thermal conductivity and high heat capacity functions into a thin, flexible package, achieving effective heat management in compact volumes while maintaining adaptability to various component locations.
2Temperature
If traditional heat evacuation solutions are used, then heat transfer is achieved, but effectiveness deteriorates when components are remotely located
Solution Approach 1:
The heat-absorbing layers are constructed with flexible jackets that can conform to various shapes and positions within the electronic device. This flexibility allows the heat management system to be effectively positioned near remote heat-generating components, improving adaptability while maintaining effective heat evacuation through the phase-change mechanism.
3Temperature
If phase-change materials are used to regulate temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat management system is divided into discrete, modular layers: heat-conducting layers with heat-collecting and heat-evacuating sections, and heat-absorbing layers containing phase-change materials. These modular layers can be independently designed, manufactured, and assembled, simplifying the overall implementation while achieving effective temperature regulation through the phase-change mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively limits temperature peaks in electronic components by transferring heat from the source to a sink while utilizing phase-change materials to regulate temperature within a specific range, preventing overheating and ensuring efficient heat dissipation in constrained spaces.
Implementation Method 1
at least one heat-conducting layer (3) having at least one heat-collecting section (5) able to be placed facing a heat source (S) and at least one heat-evacuating section (6) able to be placed facing a heat sink (P)
Implementation Method 2
at least one heat-absorbing layer (4) including a phase-change material (4b) and one face of which is adjoined to at least one portion of at least one face of said heat-conducting layer (3)
Data Source
AI summary
A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.