Heat Transferring Module for Low-Temperature Electronic Startup
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining adequate cooling in varying temperature environments, particularly in low-temperature settings, which can lead to increased volume and manufacturing costs due to the need for additional heating elements.
Innovation Solution
A heat transferring module comprising a water head, loop heat pipes, pumps, and a working fluid, where the heat generated by a heat source is transferred to ready-to-heat elements through a sequential startup process, utilizing anti-freezing and anticorrosion fluids to maintain efficiency across temperature ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heating elements are configured to heat electronic components in low-temperature environments, then the electronic device can operate in low-temperature settings, but the volume and manufacturing cost increase
Solution Approach 1:
The system uses the heat generated by operating electronic components (CPU, graphics card) to heat other components that require warmth for operation. The heat produced during normal operation is redirected to warm cold components, making the system self-heating and eliminating the need for separate heating elements.
Solution Approach 2:
The system recovers waste heat from components that generate excessive heat (like CPU and graphics card) and redirects it to components that need heating. This heat recovery approach converts otherwise wasted thermal energy into useful heating, reducing the need for additional heating devices.
2Adaptability or versatility
If heating elements are configured to heat electronic components in low-temperature environments, then the electronic device can operate in low-temperature settings, but the manufacturing cost increases
Solution Approach 1:
The system uses the heat generated by operating electronic components (CPU, graphics card) to heat other components that require warmth for operation. The heat produced during normal operation is redirected to warm cold components, making the system self-heating and eliminating the need for separate heating elements.
Solution Approach 2:
The system recovers waste heat from components that generate excessive heat (like CPU and graphics card) and redirects it to components that need heating. This heat recovery approach converts otherwise wasted thermal energy into useful heating, reducing the need for additional heating devices.
3Temperature
If conventional cooling devices are used to dissipate heat from heating elements, then heat can be dissipated, but the device volume increases
Solution Approach 1:
The patent merges the cooling function and heating function into a single integrated system. The same heat transfer loops that carry heat away from hot components can redirect that heat to cold components, combining what would traditionally be separate cooling and heating systems into one unified thermal management solution.
Solution Approach 2:
Instead of simply discarding heat to the environment through conventional cooling, the system recovers the heat and redirects it to components that need heating. This transforms waste heat into a useful resource, eliminating the need for additional heating equipment.
4Adaptability or versatility
If more heat transferring loops are added to heat multiple components, then more components can be heated, but the device complexity increases
Solution Approach 1:
The heat transfer loops are designed to serve multiple functions: they can cool overheating components, heat cold components, and dynamically adjust heat distribution based on real-time temperature conditions. This multi-functionality allows a single system to manage thermal needs of multiple components without requiring separate dedicated systems for each.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables electronic devices to quickly startup in low-temperature environments by reusing heat generated by heat sources to bring ready-to-heat elements to working temperature, thereby reducing the need for additional heating elements and saving costs.
Implementation Method 1
at least two loop heat pipes, at least two pumps... The loop heat pipes are respectively connected to the water head, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements
Implementation Method 2
The water head is thermally connected to the heat source... at least one of the loop heat pipes is thermally connected to the ready-to-heat elements
Implementation Method 3
Each of the pumps is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps
Data Source
AI summary
A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.