Heat Treated Ceramic Substrate Coating for Plasma Resistance

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Solution Overview

Problem

In the semiconductor industry, plasma-resistant ceramic materials used in plasma etch and clean processes often result in unacceptable particle contamination and delamination due to high porosity and cracking, especially in devices with critical dimensions below 45 nm, leading to increased defect rates and contamination.

Innovation Solution

A heat treatment process involving a ceramic article with a ceramic substrate and coating, where the article is heated between 1000°C and 1800°C at a controlled ramping rate to reduce porosity and cracking, forming a transition layer for enhanced adhesion and plasma resistance, thereby minimizing particle contamination and delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional ceramic manufacturing processes are used to produce plasma resistant ceramic lids and nozzles, then plasma resistance is improved, but particle contamination increases to unacceptable levels

Engineering Contradiction:

Improveplasma resistanceVSAvoidparticle contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling the heating temperature to remain below the sintering temperature of the ceramic coating throughout the heat treatment process. This parameter control prevents sintering while still achieving pore closure through thermal relaxation, thereby reducing particle contamination without sacrificing plasma resistance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining a ceramic substrate with a ceramic coating formed through thermal spraying. This composite structure allows the coating to provide plasma resistance while the controlled heat treatment process addresses the porosity issue that causes particle contamination

Inventive Principle:

Principle #40Composite materials

2Reliability

If ceramic coatings are applied to plasma resistant ceramics, then plasma resistance is improved, but delamination occurs due to high porosity and cracking

Engineering Contradiction:

Improveplasma resistanceVSAvoidadhesion strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies parameter changes by precisely controlling the heating temperature to stay below the sintering temperature of the ceramic coating. This prevents thermal mismatch and stress accumulation that would cause delamination, while still achieving pore closure and improving adhesion through thermal relaxation

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies preliminary action by performing heat treatment before the ceramic coating is fully sintered. This preliminary thermal processing closes pores and reduces cracking in advance, preventing delamination issues that would occur if the coating were allowed to sinter with high porosity

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If thermal spraying process is used to form ceramic coating, then coating formation is achieved, but porosity and cracking increase leading to particle contamination

Engineering Contradiction:

Improvecoating formationVSAvoidparticle contamination

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harm of porosity created during thermal spraying into a benefit by using controlled heat treatment to close these pores. The same thermal energy that could cause damage is instead used to densify the coating structure, eliminating the source of particle contamination while maintaining the manufacturing efficiency of thermal spraying

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat treatment process significantly reduces surface defects, porosity, and cracking in ceramic coatings, enhancing their plasma resistance and adhesion strength, leading to lower defect rates and reduced scrap rates in semiconductor manufacturing.

Implementation Method 1

performing heat treatment of the ceramic article at one or more temperatures within the temperature range for a duration of up to about 24 hours to reduce a porosity of the ceramic coating

Methodology Applied

Scientific EffectHeat treatment: Heat Treatment

Implementation Method 2

The transition layer includes first elements from the ceramic coating that have reacted with second elements from the ceramic substrate

Methodology Applied

Scientific EffectThermal diffusion: Diffusion

Implementation Method 3

performing a thermal spraying process to form the ceramic coating on the ceramic substrate

Methodology Applied

Scientific EffectThermal spraying: Plasma Spray

Data Source

PatentUS11279661B2Heat treated ceramic substrate having ceramic coating

Publication Date: 2022.03.22 APPLIED MATERIALS INC

AI summary

A heat treated ceramic article includes a ceramic substrate and a ceramic coating on the ceramic substrate. The ceramic coating is a non-sintered ceramic coating that has a different composition than the ceramic substrate. The heat treated ceramic article further includes a transition layer between the ceramic substrate and the ceramic coating, the transition layer comprising first elements from the ceramic coating that have reacted with second elements from the ceramic substrate, wherein the transition layer has a thickness of about 0.1 microns to about 5 microns.