Heated Cooling Plate for Wide-Range E-Chuck Temperature Control
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Solution Overview
Problem
Existing substrate support systems in semiconductor processing struggle to maintain precise temperature control over a wide range, from -60°C to 350°C, during various manufacturing processes such as PVD, CVD, and CMP, due to limitations in fine-tuning temperature adjustments.
Innovation Solution
A substrate support system comprising a pedestal, a chuck, a cooling plate structure thermally coupled with a heater, and a controller that adjusts cooling fluid flow and heater power using a PID subcontroller, with thermal interface materials like graphite to enhance heat transfer and control, allowing for precise temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate support system uses traditional heating and cooling methods, then it can achieve basic temperature control, but it cannot maintain precise temperature control over a wide range from -60°C to 350°C
Solution Approach 1:
The substrate support system is divided into separate heating and cooling subsystems that can operate independently or in coordination. The heating system includes a heater assembly with heating elements, while the cooling system includes a cooling plate with fluid channels. This segmentation allows each subsystem to be optimized for its specific function while working together to achieve precise temperature control across a wide temperature range from -60°C to 350°C
Solution Approach 2:
The system changes the physical state and flow parameters of the cooling fluid to optimize temperature control at different temperature ranges. By adjusting fluid flow rate, temperature, and pressure parameters, the cooling system can effectively counterbalance heating at various temperature levels, enabling precise control across the full -60°C to 350°C range while maintaining adaptability
2Speed
If the substrate support system uses aggressive cooling methods, then it can quickly reduce temperature, but it causes thermal stress that reduces component lifespan
Solution Approach 1:
The cooling system employs dynamic control of fluid flow parameters, adjusting flow rate and pressure in real-time based on the thermal state of the substrate support. This dynamic adjustment allows for rapid cooling when needed while preventing excessive thermal gradients that would cause stress, thus maintaining both high cooling speed and component reliability
Solution Approach 2:
The system incorporates temperature sensors and control logic that continuously monitor the thermal state of the substrate support and adjust cooling fluid parameters accordingly. This feedback mechanism ensures that cooling is applied at optimal rates, achieving fast temperature reduction while preventing thermal stress damage to components
3Power
If the substrate support system uses high-power heating, then it can quickly reach high temperatures, but it causes temperature fluctuations during processing
Solution Approach 1:
The heating and cooling systems operate in continuous coordination rather than alternating on/off cycles. The cooling system runs continuously at a baseline level while the heating system provides supplemental power as needed, creating a continuous balanced thermal action that eliminates temperature fluctuations and maintains stability during high-power processing
Solution Approach 2:
The system dynamically changes the power parameters of both heating and cooling systems based on processing requirements. By adjusting heating power and cooling fluid flow parameters in real-time, the system can deliver high power when needed while maintaining temperature stability through coordinated control of both subsystems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast and precise temperature control of the substrate support, maintaining the desired temperature over large ranges by effectively balancing cooling and heating, minimizing temperature fluctuations and avoiding overheating or undershooting.
Implementation Method 1
a cooling plate structure thermally coupled with the chuck
Implementation Method 2
a heater thermally coupled with the cooling plate structure
Implementation Method 3
A thermal interface material may be disposed between the heater and the cooling plate structure and between the heater and the chuck. The thermal interface material may comprise graphite
Implementation Method 4
The cooling plate structure may have conduits for cooling fluid flow
Data Source
AI summary
A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to control the cooling plate structure while controlling the heater during processing of a substrate on the chuck. The method includes cooling a substrate support with a cooling plate structure while heating the cooling plate structure with a heater thermally coupled with the cooling plate structure, monitoring the performance of the cooling plate structure and the heater, and regulating the performance of the cooling plate structure and the heater to maintain the substrate support at a desired temperature.