Heated Pre-Cleaning of Copper Base Layers for Faster Electroless Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate liquid processing methods for electroless plating are inefficient in removing oxide films from base metal layers, particularly copper, due to the lack of effective pre-cleaning processes that can be performed quickly and effectively.
Innovation Solution
A substrate liquid processing apparatus and method that uses a pre-cleaning liquid, such as dicarboxylic acid or tricarboxylic acid, heated to a temperature of at least 40°C to efficiently remove oxide films from base metal layers during the pre-cleaning process, improving processing performance by shortening the pre-cleaning time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional pre-cleaning methods are used to remove oxide films from base metal layers, then the oxide film removal is achieved, but the processing time is excessively long
Solution Approach 1:
The patent changes the chemical parameters of the pre-cleaning liquid by using dicarboxylic acid or tricarboxylic acid instead of conventional cleaning solutions. These specific chemicals react more effectively with copper oxide films, significantly reducing the time required for effective pre-cleaning while maintaining thorough oxide removal.
Solution Approach 2:
The patent employs a composite approach by combining specific organic acids (dicarboxylic or tricarboxylic acid) with controlled temperature heating. This composite treatment method creates a synergistic effect where the chemical properties of the acid work together with thermal energy to accelerate the oxide removal process, achieving both effectiveness and speed.
2Reliability
If pre-cleaning processing is performed to remove oxide films, then the base metal layer is cleaned, but the processing efficiency remains low
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: the chemical composition of the pre-cleaning liquid (using dicarboxylic or tricarboxylic acid), the temperature (heated to at least 40°C), and the exposure time. This multi-parameter optimization ensures reliable oxide film removal while significantly improving overall processing efficiency by reducing the time each parameter needs to be maintained.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of heated pre-cleaning liquids significantly enhances the reactivity and efficiency of the pre-cleaning process, allowing for the effective removal of oxide films in a shorter time frame, thereby improving overall processing efficiency.
Implementation Method 1
pre-cleaning the base metal layer by supplying a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder
Implementation Method 2
A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.
Data Source
AI summary
A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.