Heated Reducing Gas Delivery for Oxide-Free Semiconductor Bonding
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Solution Overview
Problem
Traditional semiconductor packaging methods, such as flip chip and thermocompression bonding, face challenges in preventing oxidation and contamination of copper structures during the bonding process, which can affect the reliability and efficiency of the bonding process.
Innovation Solution
A bonding system that includes a reducing gas delivery system with a heated gas delivery line and a reducing gas source, such as formic acid vapor, to create a localized reducing environment, reducing oxidation and contamination by heating the gas delivery line above the dew point of the reducing gas and maintaining a high acid concentration of 4-15% formic acid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reducing gas is delivered to the bonding area to prevent oxidation and contamination of copper structures, then the reliability of the bonding process is improved, but condensation of the reducing gas may occur in the gas delivery line, causing process instability
Solution Approach 1:
The patent applies parameter changes by heating the gas delivery line to a temperature above the dew point of the reducing gas. This temperature parameter modification prevents condensation of the reducing gas in the delivery line while maintaining its reducing properties at the bonding area, thus resolving the contradiction between reliability improvement and condensation prevention
Solution Approach 2:
The heated gas delivery line acts as an intermediary element between the reducing gas source and the bonding area. By introducing thermal energy as a mediating factor, the system prevents harmful condensation while allowing the reducing gas to perform its protective function, thus resolving the technical contradiction
2Stability of the object's composition
If the gas delivery line is heated to prevent condensation of reducing gas, then process stability is improved, but energy consumption increases
Solution Approach 1:
The patent modifies the temperature parameter of the gas delivery line to be above the dew point but not excessively high. This optimized parameter change ensures process stability by preventing condensation while minimizing unnecessary energy consumption, addressing the contradiction between stability and energy use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the removal of oxides from semiconductor and substrate surfaces, improving the overall throughput of the bonding process and ensuring better contact between conductive structures, thereby improving the efficiency and reliability of the bonding process.
Implementation Method 1
At least a portion of the gas delivery line is heated
Implementation Method 2
enhances the removal of oxides from semiconductor and substrate surfaces
Data Source
AI summary
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.