Heated Lid Ring Assembly for Plasma Chamber Wall Temperature Control
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Solution Overview
Problem
Conventional heat exchangers for temperature control in inductively coupled plasma process reactors are costly, have a large physical footprint, and are prone to leaks, leading to increased maintenance and reduced process uniformity.
Innovation Solution
A lid assembly with resistive heating elements integrated into a dielectric lid plate and lid ring, along with a heater ring for the chamber body and flow valve, providing temperature control without direct contact, reducing costs and footprint while improving process uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat exchangers are used for temperature control of the chamber body, then temperature control is achieved, but the device becomes costly, occupies large physical footprint, and is prone to leaks
Solution Approach 1:
The patent extracts the temperature control function from the complex conventional heat exchanger system and implements it through simple resistive heating elements directly integrated into the lid assembly and chamber body. This eliminates the need for separate heat exchanger components, fluid channels, and cooling systems, thereby reducing device complexity while maintaining effective temperature control.
Solution Approach 2:
The patent replaces the mechanical fluid-based heat exchanger system with an electrical resistive heating system. Instead of using circulating fluids through channels to control temperature, the invention uses electrically heated resistive elements that directly heat or cool the chamber body and lid assembly, eliminating mechanical complexity associated with fluid handling and heat exchange mechanisms.
2Manufacturing precision
If conventional heat exchangers are used for temperature control, then temperature uniformity is improved, but maintenance time increases due to leaks
Solution Approach 1:
The resistive heating elements are directly integrated into the structural components (lid assembly and chamber body) rather than being separate maintenance-prone components. This integration means the temperature control system becomes part of the chamber structure itself, eliminating separate heat exchanger units that require maintenance and reducing downtime associated with leak repairs.
3Temperature
If conventional heat exchangers are used, then temperature control is achieved, but the physical footprint increases
Solution Approach 1:
The patent merges the temperature control function with the existing lid assembly and chamber body structures. The resistive heating elements are integrated directly into these components, combining structural and thermal control functions into single elements. This eliminates the need for separate heat exchanger units and their associated fluid channels, dramatically reducing the physical footprint required for temperature control.
4Temperature
If conventional heat exchangers are used, then temperature control is achieved, but cost increases
Solution Approach 1:
The patent employs simple resistive heating elements that are inexpensive compared to complex heat exchanger systems. These heating elements can be easily manufactured and replaced if needed, providing a cost-effective temperature control solution that eliminates the high manufacturing costs associated with conventional heat exchangers, fluid channels, and associated hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances temperature control of chamber components, reduces unwanted deposits, and maintains process uniformity with a smaller footprint and lower maintenance needs.
Implementation Method 1
a dielectric lid plate coupled to a first heater having one or more resistive heating elements disposed therein that are configured to heat the dielectric lid plate
Implementation Method 2
a lid ring disposed about the dielectric lid plate and configured to hold the dielectric lid plate, wherein the lid ring includes a first heater ring disposed at an inner end of the lid ring and about the dielectric lid plate that includes a second heater comprising one or more resistive heating elements
Implementation Method 3
a second heater ring disposed between the flow valve body and the chamber body and having a third heater comprising one or more resistive heating elements disposed therein and configured to heat the flow valve body
Data Source
AI summary
Embodiments of lid assemblies for a process chamber are provided herein. In some embodiments, a lid assembly for a process chamber includes: a dielectric lid plate coupled to a first heater having one or more resistive heating elements disposed therein that are configured to heat the dielectric lid plate; a lid ring disposed about the dielectric lid plate and configured to hold the dielectric lid plate, wherein the lid ring includes a first heater ring disposed at an inner end of the lid ring and about the dielectric lid plate that includes a second heater comprising one or more resistive heating elements and wherein a radially inner surface of the first heater ring is spaced from an opposing radially outer surface of the dielectric lid plate so that the first heater ring is not in direct contact with the dielectric lid plate.