Heated Liquid Supply Line for Substrate Etching
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining high temperatures of etching liquids during supply to the substrate, leading to reduced etching rates due to temperature drops and limitations in heat-resistant components.
Innovation Solution
A substrate processing apparatus with a liquid supply line that includes a heater installed between the nozzle tip and the supply valve, ensuring the liquid is heated immediately before discharge, and a liquid recovery line with a cooler to manage temperature and prevent thermal damage to components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the liquid is heated in a liquid supply tank and supplied through a liquid supply line, then the liquid can be heated to high temperature, but the temperature drops during supply and the etching rate decreases
Solution Approach 1:
The liquid is pre-heated to high temperature in the liquid supply tank before supply, and the liquid supply line is pre-heated to minimize temperature drop during transport, ensuring the liquid arrives at the nozzle unit at the required temperature for high etching rate
Solution Approach 2:
A heater is introduced as an intermediary device in the liquid supply line to actively maintain or increase the liquid temperature during supply, compensating for heat loss and ensuring the liquid reaches the nozzle unit at the required high temperature
2Productivity
If additional additive is mixed with the liquid to increase etching rate, then the etching rate increases, but temperature reduction according to additive temperature is largely affected
Solution Approach 1:
The liquid and additives are pre-heated to the required temperature before mixing and supply, ensuring that the temperature reduction effect of adding cold additives is minimized, and the liquid maintains high temperature throughout the supply process
Solution Approach 2:
A heater in the liquid supply line acts as an intermediary to compensate for temperature reduction caused by additive mixing, actively heating the liquid to maintain the required temperature for high etching rate
3Temperature
If the liquid supply line is heated to maintain high temperature, then the liquid temperature is maintained, but thermal damage to components and heat loss occur
Solution Approach 1:
Heating is applied locally only to the liquid supply line and critical sections where temperature maintenance is essential, rather than heating the entire system, thereby minimizing energy loss while maintaining liquid temperature in the supply line
Solution Approach 2:
The temperature parameters of the liquid supply line and heater are optimized to maintain the minimum required temperature for etching while minimizing excessive heating that would cause energy loss and thermal damage to components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the discharge of liquids at ultra-high temperatures, significantly improving the etching rate and reducing etching time while ensuring the longevity of components by minimizing heat loss and thermal stress.
Implementation Method 1
a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe
Implementation Method 2
a cooler disposed between a branch point in the liquid recovery pipe, branched off the liquid supply pipe, and the recovery valve
Data Source
AI summary
A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.