Heated Single-Nozzle Substrate Treatment for Selective Etching
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Solution Overview
Problem
Existing substrate treating processes face challenges in achieving high selectivity and efficiency, particularly in etching processes, and are prone to nozzle interference.
Innovation Solution
A substrate treating apparatus and method that utilizes a support member, treating liquid nozzles, and a controller to sequentially supply high-temperature first and second treating liquids, such as a mixed liquid of phosphoric acid and silicon, and pure phosphoric acid, respectively, while minimizing nozzle interference through integrated heating and supply pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple nozzles are used to supply different treating liquids, then the substrate can be treated with high selectivity, but nozzle interference occurs and device complexity increases
Solution Approach 1:
The patent combines multiple treating liquid supply functions into a single nozzle structure. The integrated nozzle receives both first treating liquid (for silicon oxide etching) and second treating liquid (for silicon nitride etching) through separate supply pipes that merge into one nozzle, eliminating nozzle interference while maintaining selective etching capability through sequential liquid supply control
Solution Approach 2:
The patent employs dynamic control of the treating liquid supply system by sequentially activating different liquid supply pipes. The controller dynamically switches between supplying the first treating liquid and the second treating liquid through the same nozzle, enabling selective etching of different materials without requiring multiple simultaneously active nozzles
2Manufacturing precision
If multiple separate nozzles are used for different treating liquids, then selective treatment is achieved, but the number of nozzles increases causing interference
Solution Approach 1:
The patent merges multiple nozzle functions into a single integrated nozzle that sequentially receives different treating liquids. This consolidation eliminates the interference problems associated with multiple closely-spaced nozzles while maintaining the ability to selectively treat different regions of the substrate through controlled sequential supply of first and second treating liquids
3Productivity
If high-temperature treating liquids are supplied sequentially through integrated pipes, then treatment efficiency increases, but pipe contact region heating complexity increases
Solution Approach 1:
The patent segments the liquid supply system into distinct heated zones corresponding to different treating liquids. Each liquid supply pipe has a heating region that contacts the pipe at specific locations, allowing independent temperature control for the first and second treating liquids while they flow through the integrated nozzle structure
Solution Approach 2:
The patent uses the pipe contact regions as thermal intermediaries between the heating sources and the treating liquids. The heated sections of the supply pipes act as mediators that transfer thermal energy to the respective treating liquids, enabling precise temperature control without direct exposure of complex heating elements to the liquid flow paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus and method enable efficient and selective treatment of substrates with high selectivity, reducing nozzle interference and eliminating the need for additional cleaning processes.
Implementation Method 1
the first heater may heat the first treating liquid at a high temperature
Implementation Method 2
the second heater may heat the second treating liquid at a high temperature
Data Source
AI summary
Provided is an apparatus for treating a substrate. In the exemplary embodiment, the apparatus for treating the substrate includes a support member configured to support a substrate and provided rotatably; a treating liquid nozzle configured to supply selectively a high-temperature first treating liquid and a high-temperature second treating liquid onto the substrate; and a controller configured to control the treating liquid nozzle so that the treating liquid nozzle first supplies the first treating liquid onto the substrate and then supplies the second treating liquid onto the substrate.